HSIO Bench Test Engineer

Company

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Hardware Engineering

This position is for the Post Silicon Engineering group that develops test solutions for highly integrated SOCs (System on Chip) designed by Qualcomm.

Define and execute the development of test methodologies and characterization of high‑speed SERDES interfaces such as PCIe, USB3, UFS, DP, MIPI (DSI, CSI), PLLs, and leading‑edge LP‑DDR & PC‑DDR subsystem components (DRAM, DRAM controller, mixed‑signal PHY IP, IOs, clocking architecture, delay circuits, power distribution network) as well as other proprietary interfaces. Develop and execute characterization plans for high‑speed interfaces to optimize design parameters and validate electrical compliance, drive first silicon bring‑up & debug to qualify designs fabricated at external foundries, and perform technical data analysis of parametric performance over various operating conditions and configurations.

Assist in hardware design and debug power integrity (PI) and signal integrity (SI) issues related to package and board design. Work closely with cross‑functional teams such as IC design and systems engineering for chip/circuit bring‑up and debug, and with customer engineering and hardware applications teams to resolve customer issues/RMA debug in a time‑critical environment.

• Bachelor's degree in Engineering, Computer Science, or a related field.
• Work experience:
  
  3+ years preferred (fresh graduates welcome).

• Master's degree in Electrical/Computer Engineering or a related field.
• Work experience:
  
  1+ year in related areas.
• Good understanding of VLSI technologies, CMOS analog and digital integrated circuits, mixed‑signal and semiconductor physics.
• Knowledge of high‑speed test and characterization including eye diagram characteristics, differential signals, jitter analysis, signal integrity, etc.
• Familiarity with SERDES characterization/validation and transmitter, receiver design blocks.
• Familiarity with DDR 2/3/4/5, LPDDR 2/3/4/5 protocol, timing diagrams and device specifications.
• Hands‑on experience with lab equipment such as oscilloscopes, TDRs/VNAs, J‑BERT.
• Experience with Python/C# for test automation.
• Familiarity with board design concepts (schematic reviews, layout best practices).
• Good ASIC device‑level characterization skills. System‑level knowledge is a plus.
• Strong verbal and written communication skills, good organization and documentation skills.
• Strong problem‑solving & debugging skills, ability to work independently with good initiative to overcome technical challenges.
• Strong interpersonal and teamwork skills with proven ability to work effectively in a fast‑paced, multi‑disciplinary environment.

• Works under supervision.
• Decision‑making affects direct area of work and/or work group.
• Requires verbal and written communication skills to convey basic, routine factual information.
• Tasks require multiple steps which can be performed in various orders; some planning, problem‑solving, and prioritization must occur to complete the tasks effectively.

Qualcomm is an equal‑opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. For accommodations, email disability‑ Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

Qualcomm is an equal‑opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

$94,200.00 – $. The pay scale reflects the broad minimum to maximum for this job code. Additional compensation includes a discretionary bonus program and annual RSU grants. The benefits package is designed to support your success at work, at home, and at play.