Mechanical Engineer

General Summary

Qualcomm Technologies Inc. is focused on inventing technologies that connect and empower people in ways that are elegant and accessible to all. The QCT Product & Test engineering (PTE) team is responsible for developing hardware to support all engineering development and production test activities at Qualcomm.

The mechanical engineer is responsible for collaborating with multiple global engineering teams to ensure the overall design of hardware in support of product characterization and test of semiconductor devices. The role involves designing hardware that considers how the designs will function within the target test platform.

Key tasks include:

• Extensive use of 3D CAD modeling software to design mechanical hardware and fixtures that support multiple semiconductor test engineering platforms such as wafer‑probe, automated test equipment (ATE), chipset integration development platforms, and system‑level test platforms (SLT).
• Generate models and drawings for new IC semiconductor package architectures, capturing design intent and reconciling package design with target test platforms to ensure usability.
• Leverage computational analysis engineering (CAE) software tools such as Ansys Workbench, Mechanical, Icepak, Solidworks Simulation, and Creo Simulation.
• Utilize product lifecycle management software to generate engineering change orders (ECOs).
• Clearly communicate and collaborate with engineering leads to capture relevant design requirements.

• Bachelor’s degree in Mechanical Engineering or related field.

• 1+ years’ experience in the following areas:
• Knowledge of semiconductor test cell technology and operation and associated hardware design experience.
• Background in mechanical design, part fabrication techniques, and application of geometric tolerancing and dimensioning (GD&T) best practices per ASME Y14.5‑2009.
• Proficiency using Creo Parametric 3D modeling CAD software with top‑down assembly methodologies.
• Intermediate experience using ANSYS simulation software tools (e.g., Mechanical, Icepak).
• Experience conducting tolerance stack‑up analysis on complex assemblies.
• Familiarity with Agile product life‑cycle management tools.
• IC socket design or experience is a plus.
• Excellent English and communication.

• Bachelor’s degree or above in Mechanical Engineering, Material Engineering, or related field.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. You may e‑mail disability‑ or call Qualcomm’s toll‑free number for assistance. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process.

Pay range: $84,300.00 – $. In addition, Qualcomm offers a competitive annual discretionary bonus program, opportunity for annual RSU grants, and a highly competitive benefits package designed to support success at work, at home, and at play.