Senior Bench Test Engineer, HSIO

Company

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Hardware Engineering

This position is for the Post Silicon Engineering group that develops test solutions for highly integrated SOCs (System on Chip) designed by Qualcomm.

• Define and execute the development of test methodologies and characterize High Speed SERDES Interfaces such as PCIe, USB4, UFS, DP, MIPI(DSI, CSI), PLLs, and leading edge LP-DDR & PC-DDR subsystem components (DRAM, DRAM Controller, Mixed Signal PHY IP, IOs, Clocking architecture, Delay circuits, Power Distribution Network).
• Develop and execute characterization plans for High Speed Interfaces to optimize design parameters and validate electrical compliance, driving corresponding first silicon bring‑up & debugging to qualify designs fabricated at external foundries and performing technical data analysis of parametric performance under various operating conditions and configurations.
• Assist in HW design and debug of power integrity (PI) and signal integrity (SI) issues related to package and board design, working closely with IC Design, Systems Engineering, and Customer Engineering/HW Applications teams to resolve customer issues/RMA debug in a time‑critical environment.
• Follow industry trends, competitor products, and advances in engineering fields, and conduct specialized analyses (e.g., feasibility studies, signal integrity, teardown analyses).

• Good understanding of VLSI technologies, CMOS analog and digital integrated circuits, mixed‑signal and semiconductor physics.
• Knowledge of high speed test and characterization including eye diagram characteristics, Receiver JTOL performance, jitter analysis, signal integrity, etc.
• Familiarity with SERDES transmitter/receiver design blocks.
• Hands‑on experience with lab equipment such as oscilloscopes, TDRs/VNAs, J‑BERT, etc.
• Experience with Python/C# for test automation.
• Familiarity with board design concepts (schematic reviews, layout best practices, etc.) is a plus.
• Strong ASIC device‑level characterization skills; system‑level knowledge is a plus.
• Strong verbal and written communication skills and good organization/documentation skills.
• Strong problem‑solving and debugging skills; ability to work independently with good initiative to overcome technical challenges.
• Strong interpersonal and teamwork skills with proven ability to work effectively in a fast‑paced, multi‑disciplinary environment.

• Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
• Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

$ – $. In addition, employees may receive a competitive discretionary bonus program and opportunity for annual RSU grants. The detailed benefits package includes medical, dental, vision, life insurance, and other benefits that support success at work and at home.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process and will provide reasonable accommodations to support you. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected classification.