Sr Director, Cloud AI Rack Architecture and System Design

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Company:

Qualcomm Technologies, Inc.

## Job Area:

Engineering Group, Engineering Group ASICS Engineering

General

Summary:

About the role

Qualcomm's Cloud Business Unit is building next-generation AI inference rack scale solutions, anchored by the AI200/AI250 accelerator family. We are seeking a seasoned Senior Director to lead the end-to-end hardware architecture, design, and delivery of full rack-level solutions - from OCP/Open Rack-compliant chassis, power, and thermal systems to high-speed interconnects, management infrastructure, and ODM engagement. This leader will define Qualcomm's rack-scale differentiation strategy and drive execution across cross-functional hardware and systems teams.

Key Responsibilities

Rack Architecture & System Design

* Define and own end-to-end rack-scale architecture for Qualcomm AI accelerator platforms (AI200/AI250 family and future roadmap), targeting OCP Open Rack and 19" EIA form factors.

* Lead system-level design trade-offs spanning power delivery (48V DC busbar, rack PDU), cooling architecture, signal integrity, and mechanical integration.

Thermal & Cooling Systems

* Architect and oversee direct liquid cooling (DLC) systems including CDU sizing (e.g., 138+ kW per rack), blind-mate manifolds (UQD/UQDB), cold plates, leak detection, and coolant loop design.

* Ensure rack-level thermal validation and compliance with customer facility requirements (CDU inlet temperature, flow rate, pressure drop).

Power Architecture

* Define rack power delivery architectures including 48V DC busbars, modular PSU shelves and VR/PMIC integration.

* Drive power budget analysis across full rack configurations (compute blades, switches, storage, CDU) and ensure PUE/efficiency targets are met.

High-Speed Interconnects & Networking

* Lead rack-scale interconnect strategy encompassing CXL, UALink, PCIe Gen 6, and 800G/1.6T Ethernet switching fabrics (scale-up and scale-out).

* Own signal integrity requirements for high-performance PCB materials and rack-level cabling (copper and optical), including material trade-off analysis.

BMC / RMC & Rack Management

* Define and drive BMC/RMC architecture for OOB management, Redfish/IPMI compliance, telemetry, and health monitoring.

* Ensure DC-SCM 2.0 integration and multi-generation firmware roadmap aligned with OCP standards.

ODM & Ecosystem Engagement

* Lead technical engagement with ODM/OEM partners for rack-level NRE, design validation, manufacturing, and qualification.

* Partner with hyperscaler customers and CSPs to align rack-scale hardware solutions to datacenter facility and operational requirements.

Cross-Functional Leadership & Execution

* Build, mentor, and lead a high-performance team of rack-scale hardware, thermal, power, and mechanical engineers across multiple sites.

* Partner with ASIC, software, product management, and supply chain teams to drive rack-level productization milestones from concept to NPI.

* Own rack-level hardware validation and EVT/DVT/PVT planning, coordinating with QA and customer enablement teams.

* Manage rack-scale program budgets, headcount planning, and delivery schedules in alignment with Cloud BU product roadmap.

Experience

* 20+ years of experience in hardware engineering, with at least 5 years in a senior leadership role (Director or above).

* Proven track record of delivering rack-scale or full-system hardware platforms for cloud/data center markets.

* Deep expertise in OCP Open Rack v3 (ORv3) standards, OCP DC-MHS, DC-SCM, and related specifications.

* Hands-on experience with direct liquid cooling (DLC) system design and thermal architecture at the rack level.

* Strong background in high-speed digital design (PCIe Gen5/6, CXL, UALink, Ethernet 400G/800G) and signal integrity.

* Experience with rack-level power architecture including 48V DC distribution, VR/PMIC design, and efficiency optimization.

* Familiarity with BMC/RMC platforms, Redfish API, IPMI, and OCP management stack.

* Experience managing ODM/OEM partnerships for large-scale hardware development and qualifications.

Minimum Qualifications:

* Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.

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