Principal Chipset Project Engineer – Thermal​/Limits Personal Computer; PC

Principal Chipset Project Engineer – Thermal/Limits For Personal Computer (PC)

Qualcomm's Compute Chipset Project Engineering team is responsible for the planning and execution of industry leading Compute Chipsets through all phases from concept to commercialization. A Compute Chipset comprises multiple chips that together perform the functions of a compute device (such as Application Processor, PMICs, Audio, Connectivity, Modem), as well as the associated software, firmware and reference hardware.

We are seeking a Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) to lead the thermal and limits strategy across the compute product portfolio through all phases from concept to commercialization. Responsibilities include defining system thermal budgets, defining methodologies and tools to analyze and predict thermal behavior, modeling of thermals and thermally constrained performance, influencing designs and planning features, defining and tuning system limits, as well as to provide customer guidance on thermal targets and solutions.

This lead will be responsible for extracting the highest thermally constrained system performance possible out of systems with fixed product constraints. Works closely with domain and IP specific engineering leads, Project Engineers, Product Management, and Program Management. Role also requires a strong engagement with OEMs and ODMs. Responsible for clearly communicating thermal goals, strategy, and status to executives and chipset teams.

Works in a highly matrixed environment. This role frequently requires working with others to fulfill job responsibilities without direct authority.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of Electrical, Computer, or Software Engineering or related work experience. OR Master's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 7+ years of Electrical, Computer, or Software Engineering or related work experience. OR PhD in Electrical Engineering, Computer Science, Computer Engineering, or related field and 6+ years of Electrical, Computer, or Software Engineering or related work experience.

• 8+ years of experience in one or more areas of semiconductor product development.
• 5+ years in a technical leadership role.

Principal Duties and Responsibilities:

• Leverage expert knowledge to help guide design and architectural choices for the chipsets, platforms, and software to extract the highest thermally constrained performance while meeting product constraints including cost and size.

• Drive methodology and tool development to analyze and predict thermal behavior, assess performance impact, and assist thermal/power/performance tuning.

• Evaluate new and novel thermal solutions.

• Assess impact of system component selection on thermals.

• Influence system limits management feature set and establish best practices to tune for thermal management.

• Oversee the resolution of all thermal related issues across the chipsets.

• Interacts with customers frequently, providing guidance on thermal targets and support on thermal debug and tuning.

Level of Responsibility:

• Influences, provides direction and guidance to leads and managers who may not be direct reports.

• Decision-making is critical in nature and highly impacts program, product, or project success.

• Requires verbal and written communication skills to convey highly complex and/or detailed information. May require strong negotiation and influence with large groups or high-level constituents.

• Has influence over the formulation and achievement of long-term business plans and objectives.

• Tasks often require multiple steps which can be performed in various orders; extensive planning, problem-solving, and prioritization must occur to complete the tasks effectively.

Pay range and Other Compensation & Benefits :

$ - $

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation  also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).

In addition, our highly competitive benefits package is designed to support your success at work, at home, and r recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.