Senior IC Packaging Engineer: Lead Flip Chip SiP
Job in
San Diego, San Diego County, California, 92189, USA
Listed on 2026-06-28
Listing for:
Qualcomm
Full Time
position Listed on 2026-06-28
Job specializations:
-
Engineering
Systems Engineer, Electronics Engineer, Manufacturing Engineer, Electrical Engineering
Job Description & How to Apply Below
Qualcomm is looking for a highly motivated Staff Packaging Engineer in San Diego to lead the development of advanced integrated circuit packaging. The candidate will ensure the transfer of technologies into high-volume manufacturing while solving complex technical problems and collaborating with multiple suppliers.
The role requires extensive expertise in Flip Chip, Wire Bond, and SiP assembly processes, along with a Bachelor’s or higher degree in engineering. A competitive salary range from $127,200 to $190,800 along with a comprehensive benefits package is offered.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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