Principal PCB Engineer – Datacenter/Speed Systems
Job in
San Diego, San Diego County, California, 92189, USA
Listed on 2026-07-08
Listing for:
Nutanix
Full Time
position Listed on 2026-07-08
Job specializations:
-
Engineering
Manufacturing Engineer, Quality Engineering, Electronics Engineer, Process Engineer
Job Description & How to Apply Below
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group Packaging Engineering General
Summary:
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms .This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement , supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness Hands on experience with PCB process including d efin ing and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards
Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation Engage with PCB manufacturers (fabricators & assemblers) to:
Understand design rule capability (trace/space, via structures, stack-up complexity, materials)
Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies
Collect and analyze supplier data to validate manufacturing capability vs design requirements
Drive multi-source strategy and supplier qualification for high-volume production
3. NPI & Manufacturing Support Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems)
Troubleshoot PCB fabrication / assembly issues :
Yield excursions
Reliability failures
Process limitations
Lead root cause analysis and implement corrective & preventive actions (CAPA)4. Technology Roadmap Development Drive PCB technology roadmap in collaboration with suppliers:
Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)
High layer count / ultra-high density interconnect solutions
Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability
5. Industry & Competitive Intelligence Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology)
Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
ORMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
ORPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)
Strong understanding of:
High-speed design fundamentals (SI/PI, loss, impedance control)
Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)
PCB materials (low-loss laminates /Core & PPG, Cu foil , Plating chemistry, SR, Surface Finish, etc.)Experience working directly with PCB suppliers (fab + assembly/CM)
Proven track record in NPI builds and manufacturing issue resolution
Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems)
Experience driving technology co-development with suppliers
Ability to influence cross-functional and executive stakeholders
Key Competencies Strong analytical and problem-solving skills
Data-driven decision making
Ability to communicate clearly with suppliers, internal teams, and executive leadership
Experience managing…
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