Agentic AI Windows Power and Thermal Engineer

This position is not eligible for Qualcomm immigration sponsorship.Company

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Software Engineering

• Power/Thermal Software products team at Qualcomm to achieve industry leading Power/Thermal/Limit SW management solution on Qualcomm Compute, Mobile, IoT, Automotive and AR/VR chipsets.
• In this position, the candidate will be working with cross-functional teams to Profile Power & Thermal and identify Power, thermal & Peak Current risks and provide optimized solutions with proper Mitigation.
• The candidate will need to perform system level analysis of Power/thermal use cases, expected to collaborate with Architecture, HW design, Performance, Power/Thermal Systems and various software teams to work towards optimal system level Power/thermal SW solution.
• In this position, the candidate will be working on automation based on AI/Agentic AI infrastructure, that require AI Model expertise, designs, trains, and deploys neural network architectures (like CNNs, LLMs, or Transformers) and to build e2e infrastructure automation to process huge telemetry data(Power, Performance, Logs) to optimize power, performance with the e2e infrastructure automation. This cross-disciplinary role blends machine learning expertise with deep knowledge of AI infrastructure, Network Models, and cloud computing.
• In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengths and weaknesses, and come up with thermal mitigations schemes that are best in the industry.

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

• Systems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display, Graphics, etc.)
• AI Expertise - Model development, Data pipeline Management, Infrastructure Automation.
• Operating systems concepts - scheduling, memory management and device drivers.
• Using debug tools like JTAG debugger, oscilloscopes, logic analyzers.
• Knowledge on Mobile power or Power/thermal management SW development.
• In-depth knowledge in the areas of Embedded Systems, Microcontrollers, SoC Power, Modem, Multimedia, and Wireless communications, System level debugging and analysis for SoC power optimizations.

Pay range: $94,200.00 - $. This pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. In addition to salary, Qualcomm offers a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). The benefits package supports your success at work, at home, and at play.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑ or call Qualcomm's toll‑free number. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process.

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.