Principal PCB Engineer – Datacenter / High-Speed Systems
Listed on 2026-08-05
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Engineering
Process Engineer, Electronics Engineer, Manufacturing Engineer, Quality Engineering
PCB Engineer
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms. This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm's future hardware roadmap.
Key Responsibilities- PCB Design & Manufacturing Readiness
- Supplier Engagement & Capability Validation
- NPI & Manufacturing Support
- Technology Roadmap Development
- Industry & Competitive Intelligence
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
- 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)
- High-speed design fundamentals (SI/PI, loss, impedance control)
- Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)
- PCB materials (low-loss laminates /Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.)
- Experience working directly with PCB suppliers (fab + assembly/CM)
- Proven track record in NPI builds and manufacturing issue resolution
- Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
- Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems)
- Experience driving technology co-development with suppliers
- Ability to influence cross-functional and executive stakeholders
- Strong analytical and problem-solving skills
- Data-driven decision making
- Ability to communicate clearly with suppliers, internal teams, and executive leadership
- Experience managing ambiguity in fast-paced NPI environments
In this role, you will directly influence:
- Qualcomm's datacenter and AI hardware competitiveness
- Supplier ecosystem maturity and scalability
- Adoption of next-generation PCB technologies and materials
Pay range and Other Compensation & Benefits: $ - $
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).
In addition, our highly competitive benefits package is designed to support your success at work, at home, and r recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
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