Electro-Mechanical Engineer II - Microelectronics Packaging

Location:

US-CA-SAN DIEGO-SD1 ~ 8650 Balboa Ave ~ SAN ANTONIO BLDG

Country:
United States of America

Position Role Type:
Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements:
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance Security Clearance Type:
DoD Clearance:
Secret Security Clearance Status:
Active and existing security clearance required after day 1

Are you ready to explore the world of aerospace and defense? Do you want to learn from and collaborate with some of the greatest minds in the industry? At RTX, our internships, co-ops and full-time careers provide an exceptional foundation to work on complex problems, advance your skills and create a safer, more connected world. Discover opportunities to make a difference  RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems.

With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world. Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat.

We deliver solutions that help our nation and allies defend freedoms and deter aggression, creating a safer, more secure world. Join us and help shape the future of aerospace and defense.

• Support development of novel advanced microelectronics packaging solutions within a team environment for a broad range of design challenges supporting advanced radar systems and subsystems throughout various IRAD, Development, and Production environment programs.
• Utilize a variety of standard hardware and materials to develop novel design and assembly approaches for advanced electronics.
• Perform mechanical analysis of packages and systems including first-order structural, thermal, and tolerance analyses.
• Support the full mechanical design lifecycle, including requirements development, concept generation, trade studies, material selection, free-body diagram development, and geometric dimensioning & tolerancing (GD&T) application.
• Create and support 3D models, engineering drawings, tolerance analyses, and manufacturing documentation required for hardware realization primarily using PTC Creo Parametric and Windchill Product Data Management System.
• Partner with manufacturing and test teams to support prototype builds, tooling development, integration activities, and verification testing.
• Participate in technical and design reviews while ensuring designs meet performance, quality, manufacturability, and reliability requirements.
• Support mechanical development efforts for microelectronics packages and higher-level assemblies while balancing technical performance, schedule, cost, and risk considerations.
• Work with a multi-disciplined team of engineers on mechanical housing design, electronics equipment packaging, circuit card assemblies, interconnects, and thermal management.
• Create and deliver presentations with clear and concise technical content.
• Position requires a minimum of 25% of travel to suppliers and production facilities, which includes domestic and international travel.

Typically requires a Bachelor of Science degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 2 years' prior relevant experience in combination with the following:

• Experience with the design, manufacturing, and integration of mechanical assemblies, electronics packaging, and/or test equipment for military and/or aerospace applications
• Demonstrated Mechanical Engineering Design Knowledge
• Experience with Mil-Spec Hardware and Material Selections
• Experience with PTC CREO Parametric or other Mechanical CAD Tools
• Ability to Obtain a Secret or Top Secret Security Clearance

• An Existing Secret or Top Secret Security Clearance
• Experience with ANSI/ASME Y14.5 GD&T (Geometric Dimensioning and Tolerancing)
• Printed Wiring Board (PWB) Design and Fabrication Knowledge
• Circuit Card Assembly (CCA) Design and Layout Collaboration Experience
• Knowledge of Electromechanical Assemblies and the Interrelationship of the Components Therein
• Knowledge of Materials and Fabrication Methods
• Knowledge of Mechanical Fabrication Techniques (Additive, Traditional Milling, EDM, etc…)
• Experience With Suppliers of Machined Parts and Electronics
• Ability to Interpret Standard Mechanical Fabrication and Assembly Drawings
• Experience with Production Support Including Use of Basic Measurements Tools
• Knowledge of Environmental Testing and Validation
• Strong CAD, Technical Writing, and Oral Communication Skills

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