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Senior IC Packaging Engineer: FEA & CPI Lead

Job in San Diego, San Diego County, California, 92189, USA
Listing for: Socket.dev
Full Time position
Listed on 2026-08-22
Job specializations:
  • Engineering
    Packaging Engineer
Salary/Wage Range or Industry Benchmark: 127200 - 190800 USD Yearly USD 127200.00 190800.00 YEAR
Job Description & How to Apply Below

Qualcomm Technologies, Inc. is seeking a skilled IC Packaging Engineer to develop and apply mechanical FEA models for current and advanced packaging technologies. You will support design, NPI, CPI, and reliability teams with warpage, stress, and CPI analyses using ANSYS APDL/Workbench.

Requirements include a strong background in FEA, materials, packaging structures, and testing correlation. Collaboration across global teams and travel may be required, with Qualcomm offering a comprehensive

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Position Requirements
10+ Years work experience
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