Principal Engineer, Signal and Power Integrity United States of America Packaging Engineering

Company:

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Packaging Engineering

As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physics lab validation/correlation of package to system models, and the manufacturing qualification for new product introduction (NPI). Package System Design and Technology Engineers collaborate with multi-disciplinary teams to achieve optimized performance of mechanical, electrical, and thermal package systems for various end market applications.

This role interfaces with internal/external IP teams, industry standards, and vendors to set package to system design and technology specifications; enabling product designs to achieve high performance, high reliability, low cost, and easy to implement system with integrated component attaches for end customers. The candidate will work in a team-oriented, professional engineering environment to perform a variety of signal and power integrity tasks and collaborate with package and IC designers to optimize the overall package design.

Electrical model extraction and signal and power integrity simulations will constitute the majority of the tasks. This engineer must interface with a variety of board, package, and IC designers. Working effectively across organizational boundaries is essential, as is effective documentation and presentation of results. This candidate will work on high-speed memory interfaces for electrical model extraction and system-level simulation.

• Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include a variety of memory interfaces.
• Apply established methodologies to analyze IO power distribution in product development and reference systems.
• Perform package extraction for time domain and frequency domain analysis and provide design guidelines for the package design.
• Create clear and complete documentation of results.

• 8+ years of experience in DDR in Package/PCB/System Design related to compute/server standards.
• Experience in electromagnetics and a solid background in transmission line theory and crosstalk.
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, and SPICE transient simulation (ADS, Hspice), including use of IBIS and IBIS AMI models.
• Experience in DDR design specifications such as DDR and LPDDR
• Experience in Matlab to automate existing simulation flow.
• Experience in programming languages (C/C++) or scripting languages (Perl/Python) is a plus.
• Master’s or Ph.D. degree with 3+ years of industry experience.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• OR
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• OR
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call…