Tin Management Architect

ASML US, LP brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy‑efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics.

Our headquarters are in Veldhoven, the Netherlands, and we have 18 office locations around the United States including main offices in Wilton, CT, Chandler, AZ, San Jose, CA and San Diego, CA.

Job Mission We have an exciting opportunity for an experienced Tin Management Architect to join the Source Research department in San Diego and lead the definition and evolution of the next‑generation Tin Management architecture for future lithography light sources. ASML's leadership in lithography depends on continued innovation in source technology. A key challenge for future EUV systems is the management of tin debris generated during the laser‑produced plasma (LPP) process.

Effective Tin Management is critical to protecting source hardware, maintaining optical performance, enabling higher source power, and reducing cost of technology. As the Tin Management Architect, you will define the long‑term technology roadmap and system architecture required to address these challenges. Working across research, modeling, and product development teams, you will evaluate architectural trade‑offs, identify key technology gaps, guide research investments, and shape future source concepts.

The ideal candidate combines deep technical expertise with strong systems thinking and the ability to operate effectively in a multidisciplinary environment. Success in this role requires balancing physics, engineering, modeling, manufacturability, and cost considerations to drive architectural decisions at the fuzzy front end of product development.

• Define and drive the long‑term Tin Management architecture and technology roadmap, identifying architectural challenges, technology gaps, development priorities, tradeoffs, and critical learning required to guide future EUV source development.
• Shape experimental strategies and learning plans for research test rigs, ensuring test campaigns address key architectural questions and produce actionable system‑level insights.
• Define the modeling, simulation, AI, and data capabilities required to support Tin Management decisions, and guide their development in collaboration with Virtual Source, analysis, and research teams.
• Drive technical alignment between research, system engineering, product development teams, and external stakeholders to ensure Tin Management learnings influence future product architectures and node development.
• Capture, document, and communicate architectural learnings and technology recommendations to leadership and development teams through reports, reviews, and executive presentations.
• Work independently and across multidisciplinary teams to pursue new knowledge, demonstrate new capabilities, and solve critical system‑level challenges.
• Provide technical leadership for critical Tin Management initiatives while remaining actively engaged in hands‑on technology development, experimentation, modeling, and problem solving for approximately 50% of the role.
• Perform other duties as assigned or required.

• Ph.D. in Physics, Engineering, Applied Mathematics, or a related discipline, with 5+ years of relevant experience, and demonstrated expertise in complex physical systems and one or more areas such as thermodynamics, fluid dynamics, plasma physics, lasers, photonics, or related technologies.
• Strong background in experimentation, modeling, simulation, and data‑driven decision making.
• Experience applying computational modeling, data analytics, AI/ML, and digital engineering tools to technology development challenges.
• Proven experience developing and maintaining multi‑year technology roadmaps, aligning technical maturity, cost and integration readiness with business strategy.
• Demonstr…