Mechanical Engineering Internship – Summer

Company:

Qualcomm Technologies, Inc.

Interns Group, Interns Group >
Interim Engineering Intern - HW

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation.

At Qualcomm, we are engineering human progress.

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity.

With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2027 summer intern class!

As a Qualcomm Mechanical Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems that support Qualcomm’s advanced semiconductor technologies. Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions.

This internship supports the Mechanical Engineering track. Based on your resume you will be aligned to projects within this track.

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field
• Must be available for 11–14 weeks during Summer 2027 (May–September)
• Expected graduation date of November 2027 or later
• 1+ years of academic experience with programming languages such as Python, Matlab

• Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028.
• Familiarity with Cadence Sip, AutoCAD, and Solidworks
• Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
• Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
• Experience with thermal system design, modeling, and testing
• Understanding of heat transfer, mechanical design, and microelectronics
• Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
• Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from…