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Senior IC Package Design Engineer Speed SiP & RF
Job in
San Francisco, San Francisco County, California, 94199, USA
Listed on 2026-02-18
Listing for:
Apple Inc.
Full Time
position Listed on 2026-02-18
Job specializations:
-
Engineering
Electronics Engineer, Systems Engineer
Job Description & How to Apply Below
A leading technology company is seeking an IC Package Design Engineer to drive innovative package design and optimize processes for various consumer electronics. With a BS degree and over 10 years of industry experience, you will implement physical designs for advanced packaging solutions. Proficiency in Cadence Allegro and experience with high-speed interfaces are essential. This position offers a competitive salary range of $171,600 to $302,200, comprehensive benefits, and opportunities for stock options.
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Position Requirements
10+ Years
work experience
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