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Chief ECAD & AI Hardware Architect

Job in San Francisco, San Francisco County, California, 94199, USA
Listing for: 53 Stations
Full Time position
Listed on 2026-06-09
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

Location

San Francisco Office

Employment Type

Full time

Location Type

On-site

Department

Product

Why Flux

Flux is taking the hard out of hardware, by developing the first AI Hardware Engineer. Our goal is to democratize the ability to create bleeding edge hardware, and revolutionize how electronics are designed and built around the world.

The Role

We’re looking for an experienced electrical engineering leader who will own the hardware design practices and guiding principles of our platform. You’ll steer the evolution of our ECAD tool's core capabilities as well as the correctness of our AI Hardware Engineer's system knowledge and design approach. You'll actively partner with product leadership to shape and prioritize AI capability development, evaluation frameworks, and in developing scaled approaches to guide our community to successful PCB projects.

In this role, you'll grow our existing Hardware Design function and team.

This is a high‑impact, multidisciplinary role for someone who has experience building complex electronics that shipped at scale (e.g., smartphones, wearables, high‑performance compute, networking, robotics) and loves translating real‑world engineering constraints into powerful tools and AI behaviors.

What you’ll do
  • Drive ECAD feature design & specs – Craft product requirements for core ECAD behaviors across placement/routing, constraints management, stackup, impedance control, DRC/DFM, manufacturing outputs, and prototyping workflows. Co-author specs, validate by running dogfooding initiatives, beta programs, and scaled user feedback.

  • Be the design partner to AI/ML – Teach the world’s first AI hardware engineer how to design successful products. Define best practices, guardrails, and evaluation harnesses; curate datasets; review AI‑generated designs; create the AI expertise that will help more people build successful hardware on their first production run, without releasing the magic smoke.

  • Build out the Hardware Design function – Start as a hands‑on manager with two existing reports. Over time, refine the team's core responsibilities, and build a larger team that produces reference designs, demos, product specs, training, and field feedback loops.

  • Develop real hardware – Lead quick‑turn-around prototypes (from schematic to bring‑up) that exercise product/AI capabilities. Instrument designs for SI/PI and power/thermal validation; close the loop with data.

  • Amplify user insight – Adopt ownership and improve upon current user experience signals, feedback loops, and channeling user input into our iterative product design. Strategically invest in deeper customer relationships. Champion the user’s voice in cross‑functional forums. Partner closely with our software engineering department in ensuring AI evaluations are reflective of real-world user requirements.

  • Product – Be the "voice of the customer" within the organization, addressing vision, strategy, research & discovery, prioritization and cross-functional leadership.

What you’ll bring
  • Deep EE breadth + depth with real products in the field. Comfortable spanning:

    • RF & wireless: from sub‑GHz to mmWave; matching, filtering, antenna/feed layout.

    • EMI/EMC & ESD: design‑for‑compliance, grounding/return paths, shielding, filtering.

    • Power electronics: DC‑DC (buck/boost), PMICs, PoE, motor/actuator control, power sequencing, efficiency/thermal trade‑offs.

    • Analog & mixed‑signal: sensor interfaces, data converters, low‑noise design.

    • High‑speed digital: DDRx, PCIe/Ser Des, USB‑C/USB4, MIPI, Ethernet (1G–25G+); timing, skew, and equalization considerations.

    • SI/PI: signal/power integrity analysis, decoupling strategies, return‑path control.

  • PCB/stackup expertise: material selection and stackup definition, controlled impedance, differential pair tuning & length‑matching, via strategies (blind/buried, microvia, backdrill), HDI (high‑density interconnect), panelization, and build rules with fabs/EMS.

  • DFM/DFT & manufacturing: hands‑on bring‑up and debug, test coverage, fixture definition; tight collaboration with CMs/ODMs.

  • Tooling fluency: meaningful time in multiple ECADs (e.g., Altium, Cadence Allegro/OrCAD, Mentor Xpedition, KiCad, Zuken) and experience with…

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