Senior Packaging Engineer

Three Packaging (Mechanical/Electrical) Engineering roles

Location:

Bay Area, CA, USA

We are building next-generation optical interconnect solutions that enable true system-level integration for hyperscale data centers. We combine expertise in silicon photonics, packaging, fiber connectivity and system integration to deliver products that set new standards for performance, density, and scalability to drive the next generation of artificial intelligence.

We are seeking three highly skilled Mechanical and/or Electrical Engineers with strong Packaging experience to join our multidisciplinary team.

These individuals will play key roles in three different areas:

• The first role requires 8 or more years of experience in high-speed complex connectors in small spaces. Focus on co-packaged copper, flyover cable connectors, etc. This is a Senior Mechanical Packaging Engineer role.
• The 2nd role requires 10 or more years of relevant experience in advanced semiconductor packaging, FEA or thermo-mechanical reliability analysis. This is an Advanced Packaging Architect role that involves most Electrical and some Mechanical Engineering in the Packaging space.
• The 3rd role requires 7+ years of experience in precision micro‑mechanical design (optical, semiconductor, photonics, or related industry experience preferred).

(Not all required, but span all 3 roles in different combinations)

• Designing, analyzing, and validating precision components and assemblies critical to our advanced photonics and packaging solutions. The ideal candidate has strong expertise in mechanical design, finite element analysis (FEA), and tolerance analysis, with the ability to translate engineering requirements into manufacturable designs at micrometer‑level accuracy in 2.5D/3D advanced packaging.
• Design and develop precision mechanical components and assemblies for advanced optical and electronic systems that integrate into 2.5D/3D advanced packaging.
• Perform structural, thermal, and vibration analysis using FEA tools to validate designs under real-world conditions.
• Develop mechanical models for 2.5D/3D/3.5D multi-die systems including silicon and organic interposers, TSVs, micro‑bumps, and underfill materials.
• Identify critical material interactions, manage CTE (Coefficient of Thermal Expansion) mismatches, and mitigate reliability risks (e.g., delamination, cracking, solder fatigue).
• Apply Geometric Dimensioning & Tolerancing (GD&T) principles to ensure manufacturability, alignment, and performance at the micron scale.
• Develop and review detailed drawings, CAD models, and tolerance stacks.
• Collaborate with cross‑functional teams (optical, electrical, packaging, testing, manufacturing) to integrate mechanical designs into complex systems.
• Support prototype builds, testing, and failure analysis to drive design improvements.

(Not all required, but span all 3 roles in different combinations)

• Bachelor’s or Master’s degree in Mechanical or Electrical Engineering or related field.
• Product experience with 2.5D/3D advanced packaging.
• Strong proficiency in ANSYS Mechanical, including nonlinear material modeling, contact analysis, and thermal‑structural coupling.
• Strong expertise with FEA tools (e.g., ANSYS, COMSOL).
• Familiarity with 2.5D/3D IC, silicon/organic interposers, multi‑chip modules (MCM), and heterogeneous integration.
• Understanding of package materials and interfaces (solder, underfill, epoxy, molding compounds, substrates).
• Deep knowledge of micrometer‑level tolerances and tolerance stack‑up analysis.
• Proficiency in GD&T (ASME Y14.5 standards).
• Hands‑on experience with 3D CAD software (e.g., Solid Works or equivalent).
• Excellent problem‑solving skills and ability to work in a fast‑paced, collaborative environment.
• Experience in photonics packaging, semiconductor equipment, or precision optomechanical systems.
• Knowledge of materials science (thermal expansion, stress, fatigue).
• Familiarity with high‑volume manufacturing processes and DFM (Design for Manufacturability).