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Chiplet SI​/PI Engineer: Packaging & Interconnects

Job in San Francisco, San Francisco County, California, 94199, USA
Listing for: Eliyan Corporation
Full Time position
Listed on 2026-06-16
Job specializations:
  • Engineering
    Packaging Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.

The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits.

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