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Thermo-Mechanical CFD Intern CoWoS IC Packaging
Job in
San Francisco, San Francisco County, California, 94199, USA
Listed on 2026-06-21
Listing for:
Etched
Apprenticeship/Internship
position Listed on 2026-06-21
Job specializations:
-
Engineering
Mechanical Engineer
Job Description & How to Apply Below
Etched is looking for a skilled Thermo-Mechanical, CFD Simulation Engineering Intern to support Chip-on-Wafer-on-Substrate (CoWoS) package development in the Advanced IC Packaging Team. You will engage in critical analysis using ANSYS Mechanical APDL and ANSYS FLUENT for designing next-generation high-performance computing systems.
The ideal candidate is pursuing a Mechanical Engineering degree, has experience in FEA/CFD analysis, and proficiency in relevant software tools. This internship offers an opportunity to work on advanced semiconductor packaging processes.
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