Thermo-Mechanical Intern; CFD Simulation

Requirements

• Pursuing a degree in Mechanical Engineering or related field
• Academic or project experience with FEA/CFD tools and analysis
• Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT
• Understanding of semiconductor packaging materials and processes
• Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic)
• Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts
• Basic programming/scripting skills (APDL, Python, MATLAB)
• (Desirable) Knowledge of solder joint reliability and failure analysis
• (Desirable) Familiarity with JEDEC standards and reliability testing
• (Desirable) Previous internship in semiconductor industry
• We encourage you to apply even if you do not believe you meet every qualification

• We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team in Fall '26, Spring '27, or Summer '27
• You’ll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next‑generation high‑performance computing systems
• Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
• Perform thermo‑mechanical stress/strain analysis and thermal cycling simulations
• Analyze package warpage, solder joint reliability, and interconnect stress
• Develop CFD models using ANSYS FLUENT for solder reflow modeling
• Collaborate with design engineering teams on package development