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HBM SoC Physical Design Engineer PPA & Tapeout

Job in San Francisco, San Francisco County, California, 94199, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-07-15
Job specializations:
  • Engineering
    Hardware Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 180000 - 240000 USD Yearly USD 180000.00 240000.00 YEAR
Job Description & How to Apply Below
Position: HBM SoC Physical Design Engineer for PPA & Tapeout

Micron Technology in San Francisco, CA, is seeking a hands-on SoC Physical Design Engineer to drive implementation from netlist through GDSII for advanced memory/SoC products. You will partner with RTL, verification, IP, packaging and manufacturing teams to meet stringent PPA targets and signoff criteria.

Ideal candidates have tapeout experience on cutting‑edge nodes, strong scripting skills (Python/TCL), and deep knowledge of UPF/CPF power delivery.

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