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Senior FC-BGA Packaging Assembly Engineer - Global

Job in San Francisco, San Francisco County, California, 94199, USA
Listing for: Apple Inc.
Full Time position
Listed on 2026-07-18
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 180000 - 240000 USD Yearly USD 180000.00 240000.00 YEAR
Job Description & How to Apply Below
Position: Senior FC-BGA Packaging Assembly Engineer - Global Travel

Apple Inc. is seeking an IC Packaging Assembly Engineer to own the FCBGA assembly process from pathfinding to high-volume manufacturing. You will define baseline processes, BOM, and design rules for performance, reliability, yield and cost across multiple projects including SoC.

This role requires collaboration with cross‑functional teams, experience in semiconductor packaging, and willingness to travel internationally. A BS with 10+ years in packaging is expected.

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Position Requirements
10+ Years work experience
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