Senior Flip-Chip Packaging Engineer, 2.5D/3D
Job in
San Francisco, San Francisco County, California, 94199, USA
Listed on 2026-08-10
Listing for:
Conductor
Full Time
position Listed on 2026-08-10
Job specializations:
-
Engineering
Job Description & How to Apply Below
Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization.
Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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