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Manufacturing Engineer – Micro Electronics

Job in San Francisco, San Francisco County, California, 94199, USA
Listing for: Red Oak Technologies
Full Time, Contract position
Listed on 2026-07-14
Job specializations:
  • Manufacturing / Production
    Manufacturing Engineer, Lean Manufacturing / Six Sigma
  • Engineering
    Manufacturing Engineer, Lean Manufacturing / Six Sigma
Salary/Wage Range or Industry Benchmark: 90000 - 130000 USD Yearly USD 90000.00 130000.00 YEAR
Job Description & How to Apply Below

Manufacturing Engineer – Micro Electronics

6-Month Contract with strong potential for extension or full-time conversion

Free employee parking

We're partnering with an innovative Bay Area technology company developing advanced sensing and automation products used in robotics, autonomous systems, and industrial applications. We're seeking a hands‑on Manufacturing Engineer – Micro Electronics to support high-volume manufacturing readiness, process development, and continuous improvement.

What You'll Do
  • Develop and optimize manufacturing processes, production recipes, tooling, and equipment requirements for high-volume production.
  • Support process design, tooling development, validation, and manufacturing readiness for new product introductions.
  • Perform failure analysis, root cause investigations, and implement corrective actions to improve yield and reliability.
  • Drive process capability, throughput, and continuous improvement initiatives.
  • Partner closely with Design Engineering to ensure Design for Manufacturability (DFM) and support sustaining engineering efforts.
  • Improve manufacturing processes involving wire bonding, die placement, adhesive dispensing, encapsulation, and microelectronics assembly.
  • Analyze manufacturing data to identify trends and improve production performance.
  • Support production activities and collaborate with global manufacturing partners.
  • Travel internationally as needed to support manufacturing operations.
Qualifications
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Mechatronics
    , or a related engineering discipline.
  • 3–5+ years of manufacturing engineering experience in a microelectronics or semiconductor manufacturing environment.
  • Hands‑on experience with wire bonding, die bonding, die placement, adhesive dispensing, and encapsulation processes.
  • Experience operating high‑precision manufacturing equipment and production tools.
  • Python programming experience is required.
  • Strong data analysis and problem‑solving skills.
  • Experience in Microelectronics and SMT manufacturing environments.
  • Experience with equipment such as DATACON, MRSI
    , or similar high‑precision assembly platforms is highly preferred.

If you're passionate about advanced manufacturing, enjoy solving complex production challenges, and want to work with cutting‑edge technology in a collaborative, fast‑paced environment, we'd love to hear from you!

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