Head of Density Interconnect

Head of High Density Interconnect page is loaded## Head of High Density Interconnect locations:
USA - CA - San Jose (Ridder) time type:
Full time posted on:
Posted Todayjob requisition :
202632
** It's fun to work in a company where people truly BELIEVE in what they're doing!
** We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
** Head of High Density Interconnect (Vice President)
** Lumentum Holdings is seeking a Head of High-Density Interconnects to drive our short reach technology and business strategy.  In this role you will leverage Lumentum long standing position in 3D sensing and high-density interconnect to revolutionize AI infrastructure.  In this critical role you will be responsible for maturing Lumentums’ underlying technology and working with Internal BU leadership and external customers to define and deliver market leading products spanning multiple generations.

Key responsibilities:

* Owns company wide high density interconnect strategy.  Owns and drives technology development, partners with PLM and Sales to drive customer adoption and relationships.
* Partners with R&D to define and deliver high density interconnect technology roadmap.
* Works in tight connection with BU GMs, CTO office, and the executive team to scope and craft new technology-based business opportunities.
* Leads strategic technology development and initial product definition, making the appropriate tradeoffs between risk and time to market.
* Represents Lumentum at various industry leading events as it relates to AI, data center, telecom and long-haul communications.

Education
* MS, PhD, Electrical Engineering, Photonics, or related field.

Qualifications:

* 15+ years experience with high density interconnect.  Must have experience with VCSELs, uLEDs, high density SiPh or other related technology.
* Experience with HVM supply chain, OSATs, and high density packaging concepts is required.
* Experience with 3D packaging, FOWLP, and other packaging concepts is preferred.
* Ability to form and leverage relationships across Hyperscaler, Neocloud, and ASIC ecosystem to craft intersection of Lumentum hardware and customer product roadmap.
* Capable of assessing business opportunity size, scope, customers, and differentiation.  Comfortable with TAM, SAM, SOM, and ROI calculations.
* Capable of driving senior engineering projects with unclear scope, timeline, and deliverables.
* Experience with data communication protocols (Ethernet, PCIe, etc).
* Experience with high speed electrical and Optical IO concepts, Ser Des, UCIe, Ethernet PHY and Host rates, etc.
* Excellent written, presentation, and communication skills.
** Pay Range:
** E100-USA-1 :$0.00 - $0.00
** Disclaimer:
** Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.
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