Silicon Packaging & SIPI Specialist

The electrical performance of the package substrate is a primary technical challenge for our next-generation sensors. We are seeking an IC Packaging Engineer with SIPI expertise to eliminate this bottleneck. This is a high-impact role for an expert who "lives" in signal and power integrity and will own the development and delivery of advanced packaging solutions from an electrical-first perspective.

• SIPI Ownership:
  Lead the end-to-end Signal and Power Integrity (SIPI) strategy, performing extensive simulations to solve complex high-speed signaling and power delivery challenges.
• Substrate Design:
  Personally execute substrate layouts, stack-up definitions, and routing constraints for multi-chip RFIC/SoC integration.
• Advanced Modeling:
  Build and validate 3D EM models for 2.5D packages, UCIe interconnects, and interposer-based solutions.
• Co-Optimization:
  Partner with RFIC and Digital teams to optimize the "simulation-to-layout" pipeline, ensuring designs are production-ready for the automotive market.
• Analysis-Driven Design:
  Perform DC/AC/Transient analysis to meet strict target impedance and IR drop requirements.
• Automotive Execution:
  Drive DFM and reliability qualification to meet automotive-grade requirements (AEC-Q) without compromising electrical performance.
• Vendor Management:
  Lead technical engagements with OSATs and substrate suppliers to ensure layout execution matches simulation models.
• Validation:
  Correlate simulation results with lab measurements (VNA, TDR) to ensure first-pass success.

• Education:
  
  M.S. or Ph.D. in Electrical Engineering (EE)
• Technical Depth: 10+ years of experience with a primary focus on Signal and Power Integrity. Must demonstrate "True Execution" (running the analysis yourself, not just managing it).
• Tooling Mastery:
  Expert proficiency in Ansys (HFSS, SIwave, Q3D), Cadence (Sigrity, Allegro), or Keysight ADS.
• Architecture
  
  Experience:
  
  Deep knowledge of UCIe interconnects, 2.5D/3D interposers, and high-speed digital packaging.
• Manufacturing:
  Experience driving complex SIPI designs into high-volume manufacturing (HVM), ideally within the automotive or high-performance computing sectors.
• Communication:
  Ability to explain complex electrical trade-offs to cross-functional teams and thrive in a fast-paced start-up environment.

• Technical Authority:
  Define the electrical roadmap for breakthrough ADAS technology where packaging is the critical path.
• World-Class Team:
  Collaborate with elite engineers across RFIC, SoC, and system design.
• High-Growth:
  Be a key pillar of a well-funded ($150M+) start-up bringing disruptive tech to market.
• Comp & Flexibility:
  Competitive compensation, stock options, and flexible work arrangements.