Senior Package Design Engineer SoCASIC SIPI Focus in San Jose CA
Listed on 2026-02-16
-
Engineering
Electrical Engineering, Electronics Engineer
Join a growing custom SoC/ASIC development company at the forefront of advanced semiconductor technology. As a Senior Package Design Engineer
, you’ll lead high-performance package substrate design with a focus on signal integrity (SI),
power integrity (PI), and advanced routing. This is a hands‑on technical role where your expertise directly impacts next‑generation silicon solutions and contributes to a strong and expanding IP portfolio.
- Competitive pay: $190,000–$220,000 plus relocation support
- Work on outstanding, cutting‑edge technology
- Join a growing company with significant proprietary IP
- Collaborative environment where everyone contributes
- Strong opportunity to learn, grow, and expand your technical depth
- Lead package substrate design and analysis
, including SI/PI optimization and advanced routing - Perform modeling and simulation using tools such as HFSS and ADS
- Drive high-speed package and PCB design solutions for technologies like Ser Des, PCIe, LPDDR, and Ethernet
- Conduct time- and frequency-domain analysis including impedance, jitter, eye-diagram, and BER analysis
- Support PDN modeling
, electro-thermal simulation, and reliability considerations - Collaborate closely with layout engineers, marketing teams, and global design partners across the U.S. and overseas
- Contribute technical expertise during pre- and post-sales activities
, helping translate customer requirements into optimized package solutions
- BS in Electrical Engineering or related field (MS preferred)
- 8–10 years of experience in semiconductor package design
- Strong background in signal integrity and power integrity analysis
, modeling, and simulation - Experience with tools such as HFSS, ADS, Hspice, and Redhawk
- Expertise in high-speed package/PCB design and advanced interface standards
- Familiarity with electro-thermal simulation, PDN modeling, reliability analysis
, and packaging/assembly rules - Excellent communication, collaboration, and presentation skills
If you’re an experienced Senior Package Design Engineer ready to shape high-performance semiconductor solutions and grow with an innovative SoC/ASIC company, this is your opportunity. Bring your SI/PI expertise, drive impact across global teams, and help build the next generation of advanced packaging technology. Apply today.
Compensation:
$220,000 per year
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