Hardware engineer

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Job Description:

Senior Reliability Engineer, RF Characterization and Reliability

We are seeking a highly skilled and motivated Senior Reliability Engineer 3 to join our team, focusing on the radio frequency (RF) characterization and reliability test development for our cutting‑edge "Tuner Switch" products used in wireless handset chipsets. This critical function serves as a reliability expert and partner to our Research & Development (R&D), Design, and Quality teams. The ideal candidate will possess deep expertise in semiconductor device physics and reliability principles, particularly in RF and power electronics, and will be instrumental in ensuring the long‑term performance and robustness of our products.

The Senior Reliability Engineer will be responsible for defining, executing, and analyzing a combination of electrical, thermal, and mechanical stress tests to ensure the long‑term performance and reliability of 'Tuner switch' and related devices fabricated in RF CMOS technology.

Key areas of focus include:

• RF Characterization:
  • Developing and executing test plans to assess the switch device's performance across various operating frequencies, power levels, and environmental conditions.
  • Evaluating performance stability over extended stress periods.
• Wafer Level RF Testing:
  • Establishing and implementing procedures for performing critical RF reliability and performance tests early in the manufacturing process at the wafer level.
• ESD (Electrostatic Discharge) Characterization:
  • Designing and conducting ESD robustness tests (e.g., HBM, MM, CDM) to characterize the device's immunity to electrical stress events, a critical failure mechanism.
• Power Handling Characterization:
  • Assessing and validating the device's ability to reliably manage and sustain the high‑power levels encountered in typical mobile tuner applications.
• Thermal IR Characterization:
  • Utilizing advanced instruments like QFI (Quantum Focus Instruments) or similar IR thermal imaging equipment to monitor heat distribution and hot thermal spots, ensuring the device operates within safe thermal limits under various stress conditions.
• Intrinsic Device Reliability Characterization:
  • Developing and executing tests to assess the long‑term reliability of the underlying semiconductor IC process and package technologies used to construct the tuner switch.
• Advanced Life Testing:
  • Familiarity and direct experience with advanced life testing methodologies such as RF High‑Temperature Operating Life (RF HTOL) and DC HTOL.
• Failure Analysis & Root Cause:
  • Leading troubleshooting efforts, conducting root cause analysis, and coordinating failure analysis activities with internal and external labs to drive continuous improvement in design and manufacturing processes.

• Degree in Electrical Engineering, Materials Science, or a related field. Bachelors and 5+ years of related experience or Master’s degree and 3+ years of related experience or PhD and no experience and valid visa to work in the US .
• Minimum of 5 years of experience in semiconductor device reliability engineering, with a focus on RF or power conversion components.
• Proven experience in designing and executing reliability stress tests, including ESD, HTOL, and thermal testing.
• Strong analytical skills with the ability to interpret complex electrical and physical failure data.

• Direct experience with RF test equipment and measurement techniques (e.g., VNAs, power meters, spectrum analyzers).
• Expertise in RF/microwave semiconductor devices, preferably those used in wireless handsets (e.g., switches, filters, front‑end modules).
• Familiarity with industry‑standard reliability specifications and qualifications (e.g., JEDEC).
• Proficiency in statistical analysis tools (e.g., JMP, Minitab) for reliability data.

Compensation and Benefits

The annual base salary range for this position is $101,000 - $162,000

This position…