Package Design Engineer

Overview

BROADCOM is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed Ser Des and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include Ser Des at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more.

You ll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

• Overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal management, in partnership with our team of package engineering experts.
• Package design of critical structures for Ser Des, ADC/DAC, DDR, etc.
• Schedule, prioritize, and track work across 2+ projects simultaneously.
• General flip-chip BGA package design and engineering.
• Project management and customer interface for design projects.
• Contribute to efficiency improvements for the design team through process development/improvement, automation, and documentation.
• Physical design (layout) as a foundational responsibility in this role.

• BSEE or similar field with 12+ years’ experience in flip-chip-BGA package design, including high-speed Ser Des, or MSEE or similar field with 10+ years’ experience.
• Knowledge of package-level signal integrity and power integrity to apply to package designs.
• Cadence APD (Allegro Package Designer) experience is preferred; equivalent tool experience is acceptable.
• Ability to collaborate with a worldwide team across multiple time zones, including co-design with internal and external (Vendor) designers.
• Self-management and strong organizational skills.
• Preferred candidates will have 1+ years experience with Cadence SKILL for Allegro, or similar design-automation coding experience.

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.

The annual base salary range for this position is $141,300 - $226,000. This position is eligible for a discretionary annual bonus and equity in accordance with relevant plan documents and equity award agreements. Broadcom offers a comprehensive benefits package including medical, dental and vision plans, 401(k) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), paid holidays, paid sick leave and vacation time.

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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