Director Advanced Packaging; .5D​/3D)– Advanced Materials & Thermal Integration

Senior Packaging Engineer – Advanced Materials & Thermal Integration

Location:

San Jose, CA

Company:
Destination 2D Inc.

Destination 2D is pioneering CMOS-compatible graphene technologies that are redefining semiconductor performance—from beyond-copper interconnects to next-generation thermal management and heterogeneous integration.

We’re looking for an exceptional Senior Packaging Engineer to help translate these groundbreaking materials into scalable, manufacturable packaging solutions for future computing platforms.

• Architect and evaluate advanced packaging solutions that leverage emerging materials with superior thermal and mechanical properties.
• Develop integration pathways for graphene and other 2D materials in next-generation packaging and heterogeneous integration platforms.
• Analyze and optimize thermal transport, power delivery, and structural reliability in advanced packages.
• Collaborate closely with device, materials, and process engineers to bring novel materials from concept to manufacturing.
• Contribute to technical publications, patents, and technology roadmaps shaping the future of semiconductor packaging.

• PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
• 7+ years of experience in advanced semiconductor packaging or heterogeneous integration.
• Experience working with emerging or novel materials for thermal management or packaging innovation.
• Proven track record of technical leadership, publications, or patents in packaging, thermal transport, or materials engineering.
• Deep understanding of heat transfer, power delivery, reliability, and system-level integration.

Join us in shaping how graphene and other atomically engineered materials redefine semiconductor packaging for the AI and high-performance computing era.