Optical-Electronic Packaging Engineer

Department:
Research & Development

Location:

San Jose, California, USA

We are seeking Mechanical Engineers to support the design and development of next‑generation high‑speed optical modules for AI and data center interconnect applications. The role focuses on advanced mechanical and thermal packaging solutions for high‑density, high‑power optical modules, including pluggable form factors and emerging packaging architectures. Engineers will define and deliver mechanical package solutions from early concept and system architecture through prototyping, validation (EVT/DVT), and high‑volume manufacturing ramp.

Senior engineers provide technical leadership, influence mechanical and thermal architecture decisions, and contribute to long‑term platform and technology roadmap development.

• Design and develop mechanical packaging solutions for high‑speed optical modules used in AI and data center interconnect systems.
• Drive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production ramp.
• Develop detailed 3D CAD models and engineering documentation.
• Perform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long‑term reliability.
• Own GD&T definition and tolerance stack‑up analysis for high‑density opto‑electro‑mechanical assemblies.
• Design fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturing.
• Collaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply‑chain teams to deliver integrated, system‑aware solutions.
• For senior‑level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategy.

• B.S. in Mechanical Engineering or a related discipline (M.S. or Ph.D. preferred).
• Typically 5+ years of relevant industry experience for senior‑level consideration; motivated early‑career engineers with strong fundamentals and relevant project experience are also encouraged to apply.
• Prior experience developing optoelectronic or high‑speed electronic products for data center, AI, or high‑performance computing applications is highly valued.
• Strong proficiency in mechanical design and thermal simulation tools such as Solid Works, FloTHERM, or equivalent CAD/FEA platforms.
• Deep understanding of thermal management, structural analysis, and high‑density packaging design.
• Experience with GD&T and tolerance stack‑up analysis for complex assemblies.
• Familiarity with high‑density, non‑hermetic optical module packaging and design for manufacturability (DFM/DFA).
• Working knowledge of data analysis tools (e.g., JMP) and basic scripting or programming (VB, C, MATLAB, etc.) to support testing and automation is a plus.
• Ability to operate independently on complex technical problems while contributing effectively in a highly cross‑functional environment.

• Self‑motivated and adaptable in a fast‑paced R&D and NPI environment.
• Willingness to travel internationally (up to 25%) to manufacturing and contract manufacturing sites to drive NPI execution, manufacturing readiness, yield improvement, and high‑volume production ramp.

P70‑USA‑1 : $ – $