Chip Lead​/ASIC Director

The Role

As ASIC Director – Chip Lead in our Product Development team, you will be responsible for providing technical leadership to one or more Adaptive & Embedded Computing Group (AECG) device programs. You will have sign‑off responsibility for the technical execution of device programs from conception and planning to release to manufacturing. Your leadership responsibilities will focus on problem solving in all aspects of the device development cycle including architecture, RTL, analog & custom design, design for test & manufacturing, verification, physical design & timing closure, physical verification, tape‑out and post‑silicon validation & qualification.

When a problem does not clearly fall under the banner of one technical team or another it becomes the responsibility of the Chip Lead to bring expertise, experience and diplomacy together to coordinate a solution.

This position requires a wide breadth of understanding of and experience with ASIC design and development. It also requires strong interpersonal skills to resolve issues between highly skilled and experienced engineering colleagues. A successful candidate will work with senior silicon design engineers, architects, and micro‑architects from a wide variety of technical teams. The candidate will be attuned to the overall goals and objectives of the program and employ excellent communication and problem‑solving skills.

• 15+ years of experience required in ASIC Development Lifecycle. FPGA technical experience is a huge plus
• 5+ years of experience in a leadership role with a semiconductor company
• Master’s or PhD in Electrical Engineering, Computer Engineering, or related technical field
• Post‑silicon validation experience is a strong asset
• Strong understanding of semiconductor industry and products. Experience working with Product Planning and Marketing teams is preferred

• Chip Definition and Feasibility – identify critical trade‑offs and architectural decisions
• Advise on feasibility including early estimates of schedule, cost, size, power, floorplan and identify key implementation decisions
• Serve as Engineering’s interface to Technical Marketing; ensuring the product meets customer needs and supports the required functions and usage modes
• Define/identify new device‑specific functionality (with Marketing and Architecture)
• When needed, negotiate for a new, new version or new variant of an IP (with the IP/COE Lead)
• Be aware of devices and programs throughout the organization; foster engineering re‑use
• Help resolve issues and guide trade‑offs that arise during any phase of the program but especially in Physical Design

The Chip Lead works with one or more Program Managers. The Program Manager tracks that IP and chip development milestones and deliverables are achieved as scheduled. The Chip Lead engages and resolves the problem when some aspect of the program is not meeting its planned objectives. When engineering or marketing initiates a change to the program, the Chip Lead communicates the change and its consequences to all stakeholders.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal‑opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.