Principal Signal & Power Integrity

Principal Package Signal & Power Integrity

San Jose, California, United States

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity.

The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at  .

Job Description:

As a Principal Package Signal & Power Integrity Engineer at Astera Labs, you will serve as a senior technical leader responsible for architecting, optimizing, and signing off package SIPI solutions for next-generation connectivity products. You will drive package electrical architecture across high-performance IC packaging platforms, including FCBGA, coreless substrates, chiplet-based packages, 2.5D/3D integration, silicon interposers, bridge-based interconnect, and heterogeneous multi-die systems.

In this role, you will lead SIPI strategy and execution for products supporting PCIe, CXL, Ethernet, 200G/400G+ Ser Des, and die-to-die interconnect. You will partner closely with silicon architecture, Ser Des/IP teams, package design, PCB design, hardware validation, manufacturing, substrate vendors, and OSAT partners to optimize signal integrity, power delivery, substrate/interposer routing, bump planning, and system-level electrical performance while balancing cost, manufacturability, reliability, yield, and schedule.

You will also drive SIPI methodology, modeling standards, simulation-to-measurement correlation, and chip–package–board co-design frameworks to enable scalable execution across multiple product lines.

• Define package SIPI architecture and design strategy for high-performance connectivity products, including PCIe 5.0/6.0/7.0, CXL, Ethernet, 200G/400G+ Ser Des, and die-to-die interconnect.
• Perform package and system-level SI and PI simulations using industry-standard simulation software such as HFSS, SIwave, and Keysight ADS to develop, optimize, and sign off package electrical models, validate package architecture and designs, and ensure robust signal and power integrity across chip–package–board systems.
• Lead cross-functional execution across silicon team, package design, marketing and APPs, PCB board team, validation team, package manufacturing, and external substrate/OSAT partners, managing technical tradeoffs among SIPI performance, cost, DFM, yield, etc., and deliver packaging solutions on schedule.
• Drive simulation-to-measurement correlation strategy, ensuring strong alignment between EM extraction, system-level models, and lab validation (VNA, TDR, high-speed oscilloscope), continuously improving model accuracy, simulation efficiency, and SIPI signoff criteria.
• Own SIPI simulation and signoff for advanced packaging platforms, including chiplet-based packages, 2.5D/3D integration, silicon interposers, and bridge-based interconnect, by leading simulations for D2D interconnect (e.g., UCIe), multi-die PDN, micro-bump modeling, TSV/interposer modeling, and multi-die CPM co-simulation.
• Define substrate, interposer, and bridge routing guidelines for high-speed Ser Des and D2D interfaces, including impedance targets, differential-pair geometry, via/transition optimization, return-current management, shielding, skew control, and crosstalk isolation.
• Establish SIPI modeling standards, design rules, review checklists, automation flows, and signoff methodologies to improve execution efficiency, while mentoring engineers across the organization.

• 10+ years of experience in signal integrity, power integrity, package electrical design, or chip–package–board co-design for high-performance semiconductor products.
• Deep…