IC Package Design Engineer

Piper Companies is looking for an IC Package Design Engineer to join a cutting‑edge start up on site Monday through Friday near San Jose, CA. The ideal IC Package Design Engineer will lead the physical layout of advanced multi‑die substrates that integrate multiple chiplets into a high‑density, high‑performance package.

• Lead the physical layout of complex multi‑die substrates while supporting chiplet‑based integration.
• Collaborate with package integration, signal/power integrity, and mechanical teams to ensure successful layout implementation.
• Drive routing feasibility and co‑design alignment with floor planning, mechanical, and system constraints.
• Own the full layout process, ensuring performance, manufacturability, and design quality.
• Use industry‑standard tools like Siemens Xpedition and Cadence Allegro APD to execute and refine substrate designs.

• 8+ years of experience in substrate layout design for advanced packaging.
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
• Strong background in physical layout and collaboration with ASIC, signal, and power teams.
• Proficient in Siemens Xpedition and Cadence Allegro APD.
• Bachelor’s degree in Electrical Engineering preferred.

• Salary Range: $200,000 – $260,000 annually
• Comprehensive benefits:
  Medical, Dental, Vision, 401(k), PTO, Sick Leave (if required by law), and Holidays.

This job opens for applications on 5/14/2026. Applications will be accepted for at least 30 days from the posting date.