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Substrate​/Layout Engineer

Job in San Jose, Santa Clara County, California, 95199, USA
Listing for: Broadcom
Full Time position
Listed on 2026-06-18
Job specializations:
  • Engineering
    Electronics Engineer, Electrical Engineering, Systems Engineer
Salary/Wage Range or Industry Benchmark: 141300 - 226000 USD Yearly USD 141300.00 226000.00 YEAR
Job Description & How to Apply Below
Position: Substrate/Package Layout Engineer

Job Description

Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In this role, the primary responsibility is the layout, routing, and functionality of packages and substrates, including design of high‑speed lines. Expertise with design tools such as Calibre/Klayout and Cadence tools (Allegro Package Design, Innovus, and Virtuoso) is required.

In this role you will work closely with core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs are also an important element. You will work with vendors to define layout/panel/stack‑up design and other specifications. Additionally you will help evaluate parts after fabrication, including visual inspection, electrical functionality, and characterization of high‑speed lines.

Responsibilities
  • Design and layout advanced substrates and IC packages
  • Develop and utilize script‑based layout tools
  • Collaborate with design and verification teams to ensure layout meets specifications and performance requirements
  • Perform DRC and LVS checks
  • Contribute to the development and improvement of layout methodologies and flows
Job Requirements
  • Bachelor's degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience
  • Or Master's degree and 10+ years of related experience or PhD and 7+ years of related experience
  • Deep knowledge and expertise with Cadence layout tools and EDA tools
  • Broad understanding of multilayer high‑speed RF design, package/substrate manufacturing processes and materials, and surface mount technology
  • Simulations of designs and improvement suggestions
Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000. You will be eligible for a discretionary annual bonus and the opportunity to receive a competitive new hire equity grant, as well as annual equity awards.

Broadcom offers a comprehensive benefits package including medical, dental and vision plans, 401(k) participation with company matching, Employee Stock Purchase Program, Employee Assistance Program, company paid holidays, paid sick leave, vacation time, and paid family leave.

Equal Opportunity Employer

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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