Component Engineer - Semiconductor

Component Engineer – Semiconductor

Hybrid role, 2 days per week from an HPE office.

Hewlett Packard Enterprise is a global edge‑to‑cloud company that helps companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world.

In this key position within the CETQ department, you will be responsible for semiconductor component engineering for the CommIC products family. This role will be a technical resource with responsibility for design‑in, testing, manufacturing and quality of all CommIC products, serving as the primary resource for design teams across Juniper Engineering through all lifecycle phases from new product introduction to end of life.

• Define and review CommIC product test coverage at NPI and sustaining phases.
• Drive the CommIC technical ecosystem and internal stakeholders on testing optimization for quality, cost, efficiency and risk.
• Address quality issues of CommIC products arising from customer and manufacturing events and follow up with suppliers for corrective actions.
• Act as point of escalation for component failure analysis, containment, and corrective actions; interface with manufacturing and engineering management to resolve complex technical problems.
• Regularly review CommIC supplier performance with respect to improvements in technology, yield, DPPM, service, etc.
• Partner to develop commodity strategy, supplier selection, and perform supplier technical audits.
• Work with the Supplier Quality Engineering team on component quality metrics and initiatives to ensure defect‑free product shipments.
• Assess and qualify new CommIC components and conduct value engineering activities.
• Maintain and manage changes, including technical evaluation of changes to the Juniper Approved Vendor List (AVL) and document management using applicable software.

• MSEE or equivalent with 5+ years semiconductor development, component and/or manufacturing experience.
• 4+ years of applicable CommIC design, testing and/or engineering experience supporting large complex systems, ideally in a high‑speed networking environment.
• Extensive knowledge of semiconductor device physics, fabrication process, design, architecture, manufacturing, test, assembly, failure mode, quality and reliability.
• Experience with Linux or FreeBSD platforms, and with both die‑level and packaged‑part products.
• Customer‑service orientation and ability to lead cross‑functional teams with collaboration and expertise.
• Strong oral and written English communication skills for complex technical issues to varied audiences.
• Data‑driven, results‑oriented mindset with ability to work effectively from a business and technical perspective.
• Experience interacting with senior or executive management on multi‑functional matters.
• Ability to influence key business or technical strategies with company‑wide impact.

Job:
Engineering – Job Level:

Salary:
Annual USD 75,400 – 143,200 in Colorado; 81,400 – 164,400 in California & New York; 71,500 – 164,400 in District of Columbia & Florida & Illinois & Michigan & Minnesota & New Jersey & Oklahoma & Texas & Washington (Base salary; variable incentives may also be offered).

Information about employee benefits offered in the US can be found at

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, color, religion, or any other protected category, and all decisions are made on the basis of qualifications, merit, and business need. We comply with all applicable laws related to employer use of arrest and conviction records, including laws restricting consideration of qualified applicants with criminal histories.