Senior IC Packaging Architect — Hybrid

Advanced Micro Devices in San Jose, California is seeking an advanced packaging technology leader responsible for driving packaging architecture across products. The role requires collaboration with product design and technology development partners to establish a packaging roadmap, leading initiatives from concept to qualification.

The ideal candidate will have a proven track record in semiconductor technology development, excellent communication skills, and a strong educational background in relevant fields. The position emphasizes collaboration across teams and developing yield improvement strategies for innovative packaging solutions.