Staff Engineer, Mechanical Simulation

Staff Engineer, Mechanical Simulation

San Jose, California, United States

Advancing the World's Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you'll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what's possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicated to empowering people to be their true selves. Together, we're building a better tomorrow for our employees, customers, partners, and communities.

Join Samsung Semiconductor to guide the development and design evaluation of next-generation semiconductor packages and memory devices. In this role as a Staff Engineer for Mechanical Simulation, you will partner with cross-functional, multicultural teams to advance innovative packaging solutions, automate simulation workflows, and bridge the gap between numerical predictions and experimental validation.

Location:

Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10-20% of domestic and international travel.

Reports to:

Principal Engineer

• Perform advanced numerical modeling and simulation to evaluate and improve the performance and reliability of cutting-edge semiconductor packages and memory devices.
• Provide mechanical and thermal design support throughout package- and system-development stages—from concept and detailed modeling to qualification and reliability testing.
• Apply hands-on expertise in mechanical and thermal modeling of micro-electronic components, including interconnects, solder joints, BGAs, and advanced-packaging architectures.
• Develop and maintain scripts for process automation (Python, MATLAB, or ANSYS APDL) to streamline pre-processing, simulation, and post-processing workflows for parametric and sensitivity studies.
• Leverage a solid understanding of semiconductor manufacturing, advanced-packaging technologies, material properties, and associated design and reliability constraints.
• Design, execute, and interpret validation experiments that correlate and calibrate simulation models with empirical data.
• Contribute effectively both independently and as a member of cross-functional, cross-cultural, and globally distributed teams.

• Ph.D. in Mechanical Engineering, Materials Science, Physics, or a related field. (Equivalent combination of a Master's degree and extensive professional experience also welcomed).
• 3+ years of hands-on modeling and simulation experience in the high-tech or semiconductor industry.
• Proven expertise with leading simulation tools such as ANSYS, Abaqus, Hyper Mesh, and their associated pre-/post-processing software.
• Proficiency in thermal-analysis platforms Flotherm and Icepak, together with related utilities.
• Extensive experience in static and dynamic simulations, covering linear and nonlinear analyses that involve geometric and material non-
• Deep knowledge of design strategies for advanced packaging solutions.
• In-depth understanding of advanced semiconductor packaging, interconnect structures, and reliability-modeling techniques.
• Strong technical-writing skills, capable of producing clear, comprehensive documentation and communicating complex concepts to both technical and non-technical audiences.
• You're inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.