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ASIC Package Design Manager

Job in San Jose, Santa Clara County, California, 95199, USA
Listing for: Broadcom Inc.
Full Time position
Listed on 2026-07-17
Job specializations:
  • Engineering
    Electronics Engineer, Operations Management, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 143800 - 230000 USD Yearly USD 143800.00 230000.00 YEAR
Job Description & How to Apply Below

Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed Ser Des and very high‑power delivery needs. The role is part of a worldwide R&D team developing high‑performance package designs for AI, networking, HPC, and 5G base stations, including Ser Des at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more.

The manager will support and develop the engineering team while contributing to technical methodologies and project management.

Responsibilities
  • Understand the skill sets and traits of each team member to maximize productivity and retention.
  • Create and track project plans for 20+ concurrent designs (scope, schedules, resources).
  • Organize team and customer activities to keep projects on track.
  • Communicate plans, status, next steps and risks.
  • Create technical methodologies for package design.
  • Steer package technology and design rules, with input from team members.
  • Collaborate with customers, vendors and cross‑functional teams.
Qualifications
  • Preferred candidates have prior experience managing people and projects.
  • BSEE/MSEE or equivalent, with 12+ years of experience in flip‑chip‑BGA package design, including high‑speed Ser Des, and a minimum of 3 years in management.
  • Knowledge of package‑level signal integrity and power integrity applied to package designs.
  • Experience cooperating with a worldwide team (multiple time zones), including co‑design with internal team members and external (vendor) designers.
  • Strong self‑management and organization skills.
  • Technical knowledge of package design lifecycle, substrate and package integration into ASIC design and manufacturing flows.
  • Familiarity with design data (MCM, package spreadsheets, drawings such as POD, Lid, Substrate), DFx trade‑offs (design for manufacturability, reliability, supply assurance, SI/PI), layout SI/PI extraction and simulations, automation code development, mechanical and thermal modeling, project management, and new business quoting.
Other Requirements
  • Work on‑site at the Broadcom office, 5 days a week.
  • This position is not remote; occasional travel may be required.
Compensation and Benefits
  • Annual base salary range: USD
    143,800 to USD
    230,000.
  • Eligibility for a discretionary annual bonus.
  • Opportunity to receive a competitive new‑hire equity grant and annual equity awards.
  • Broadcom offers a comprehensive benefits package: medical, dental and vision plans; 401(k) participation with company matching;
    Employee Stock Purchase Program (ESPP);
    Employee Assistance Program (EAP); company‑paid holidays, paid sick leave and vacation time.
  • The company follows all applicable laws for paid family leave and other leaves of absence.
Equal Opportunity Employer

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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