Senior RF Test & PCB Design Engineer

Position Title:

562113-Senior RF Test & PCB Design Engineer

Location:

San Jose, CA

Pay Rate: $75-$80

Clear Background, Drug Test, Education Check. Must be authorized to work in the US for any employer without Sponsorship. (Principal Only! No Corp to Corp)

• PCB Development:
  Lead schematic entry, component selection, and layout routing optimization for complex RF evaluation boards using Cadence Allegro.
• Simulation & Analysis:
  Perform Signal Integrity (SI) and Power Integrity (PI) simulations. Utilize Ansys HFSS for EM modeling and impedance matching to ensure optimal RF performance.
• Hardware Bring-up:
  Own the board bring-up process, including debugging hardware issues and validating performance against design specifications.
• RF Characterization:
  Utilize lab equipment (VNAs, Spectrum Analyzers, Signal Generators) to perform various RF measurements and verify simulation-to-measurement correlations. Implement Machine Learning techniques to analyze large datasets and identify performance trends or anomalies.
• Cross-functional Collaboration:
  
  Work closely with RFIC Design and System Engineering teams to define board requirements and provide feedback on chip-level performance.
• Documentation & Data Analysis:
  Maintain detailed design documentation and test reports for internal and external stakeholders. Collect, review and analyze test data.

• Education:
  
  BS or MS in Electrical Engineering or a related technical field.
• Experience:
  
  5+ years of hands‑on experience in RF PCB design and hardware development.
• Tools:
  Expert-level proficiency in Cadence Allegro / OrCAD and Ansys HFSS (or equivalent EM simulation tools).
• RF Fundamentals:
  Strong knowledge of RF theory, including S‑parameters, transmission line theory, matching networks, and de‑embedding techniques.
• Lab Expertise:
  Extensive experience with RF test equipment (VNAs, Spectrum Analyzers, Oscilloscopes) and high‑speed probing techniques.
• Materials Knowledge:
  Deep understanding of PCB stack‑ups, dielectric materials (e.g., Rogers, Megtron), and manufacturing constraints for high‑frequency PCB designs.
• Automation:
  Proficiency in Python or C# for developing automated test suites to increase characterization throughput.
• Data Science for RF:
  Experience applying AI/ML models for predictive maintenance of test setups or for signal classification.
• Wafer‑Level Testing:
  Experience with manual or semi‑automated RF probe stations for on‑wafer die characterization.

We encourage minorities, women, protected veterans and disabled individuals to apply for all positions that they may be qualified for. We maintain a drug‑free workplace and perform pre‑employment substance abuse testing and background checks.

Job Posted Date: 4/28/2026