Principal ASIC Engineer; Reliability & Hardware Validation Hybrid

The application window is expected to close on: 08/31/2026

The Cisco Hardware Engineering Team develops and works with Next Generation Technology to build Cisco Hardware products keeping in mind the user experience and in accordance with IEEE standards, and industry best practices. Hardware Engineers serve a range of roles at Cisco from IP Creators and architects creating industry standards, to Solution Integrators driving cross-functional teams to go from concept to production, as well as providing expertise in Solution Verification and ensuring that our products meet Cisco and Industry quality standards.

They drive innovation across the large CISCO portfolio, including but not limited to System/Board Design, Circuit Board Layout, Hardware Automation, Validation and Test, Signal Integrity and Power Design. They work multi-functionally with system designers, diagnostics engineers, customer escalation engineers, & external vendors to ensure robust test methodology & timely issue mitigation resulting in high product quality and enable next generation solutions.

They drive innovation across Cisco's hardware portfolio and enables next generation solutions through IP development, research, and challenging the status quo within the industry finding ways to optimize cost, performance, and quality.

We are seeking a highly skilled Engineer to lead the reliability and hardware design validation for our next-generation semiconductor and networking products. The ideal candidate will bridge the gap between advanced semiconductor reliability testing and high-speed hardware board design, ensuring our products meet the highest standards of quality, performance, and reliability in hyperscale environments.

You will drive innovation by challenging the status quo, transitioning our reliability approach from traditional methods to ground breaking, industry-leading practices. You will act as a primary technical consultant to business leaders, translating sophisticated engineering challenges into clear business value, and lead multi-functional teams through the entire lifecycle—from design FMEA to production qualification.

• Qualification Strategy: Define and execute comprehensive product/process qualification plans for next-generation, high-power solutions (wafer/package level).
• Reliability Execution: Drive robust, error-free HTOL, Burn-In, and stress testing (HAST, TC, HTS, ESD, LU, SER). Manage reliability suppliers and subcontractors to ensure adherence to qualification schedules.
• Hardware Design & Validation: Lead hardware design, schematic generation, and design validation for service provider routing products. Manage board bring-up and debug processes.
• Failure Analysis: Drive failure analysis activities and generate detailed qualification reports to ensure product integrity.
• Multi-functional
  
  Collaboration:
  
  Partner with eCAD, FPGA, Power, Mechanical, Signal Integrity, and Manufacturing teams to support design-for-reliability and high-speed interface compliance.
• Customer Support: Provide technical documentation and support for customer quality and reliability requirements.

• Education: Master’s degree in electrical engineering, Computer Engineering, or a related field.

• Experience: 10+ years of professional experience in semiconductor reliability and/or high-speed hardware design.
• Reliability Expertise: Proven experience in developing high-power HTOL/Burn-In testing for advanced node products. Deep knowledge of JEDEC, AEC, and Telcordia standards.
• Hardware Expertise: Hands-on experience with high-speed network interfaces, board design, and familiarity with tools such as Cadence Allegro.

• Technical
  
  Skills:
  
  Experience with high-speed measurement equipment and automated test development. Ability to interpret sophisticated schematics and layouts. Proficiency in data analysis/debug and HTOL set-up

• Education: PhD in Electrical or Computer Engineering.
• Advanced Node
  
  Experience:
  
  Experience with 2nm/3nm Hyperscaler Multi-Chip-Modules and advanced packaging (CoWoS, SoIC, EMIB).
• High-Speed Design: Deep…