Failure Analysis Engineer
Listed on 2026-08-11
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Engineering
Electronics Engineer, Quality Engineering, Systems Engineer, Test Engineer
Overview
We are seeking a highly technical Failure Analysis Engineer to support ASIC Chip products by investigating chip-level failures returned through the RMA process from contract manufacturers and customers. This individual will be responsible for developing and driving comprehensive failure analysis (FA) plans, interpreting diagnostic results, and partnering with specialized laboratory teams to identify root causes and support the delivery of technical reports within aggressive customer turnaround timelines.
ResponsibilitiesThe ideal candidate will have a strong understanding of semiconductor failure analysis methodologies, silicon design architecture, and advanced diagnostic techniques. While this role does not require hands‑on operation of all FA equipment, the engineer must understand when and why specific analytical techniques should be used and be capable of directing lab teams through the investigation process.
Location & Compensation5 days onsite in San Jose. Hourly rate expectation: $75-$80/hr.
Equal Opportunity & Diversity StatementWe are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances.
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Skills and Requirements- Bachelor's degree in Electrical/Electronics Engineering or related field required
- 3-5+ years of experience in semiconductor failure analysis field working with ASIC chips
- Proven ability to write and execute FA plans and interpretation of results from FA techniques such as cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, IR/EMMI/OBIRCH
- Experience working with the Avalon tool
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