Senior Substrate & Advanced Packaging Engineer (3DIC)
Job in
San Jose, Santa Clara County, California, 95199, USA
Listed on 2026-08-22
Listing for:
TSMC
Full Time
position Listed on 2026-08-22
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer, Electronics Engineer
Job Description & How to Apply Below
TSMC is seeking a highly skilled Substrate / Advanced Package Engineer to join our 3
DIC design team in San Jose, CA. The role involves design, simulation, and modeling of complex substrate and packaging technologies. Ideal candidates will have a Master’s or Ph.D. and 15+ years of experience in semiconductor physics and advanced packaging technologies.
With responsibilities including optimization and collaboration across teams, this position offers a competitive salary ranging from $153,500 to $250,000 annually, alongside comprehensive benefits and career development opportunities.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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