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Project Architect - Manufacturing

Job in San Jose, Santa Clara County, California, 95199, USA
Listing for: Imec India Private Limited
Full Time position
Listed on 2026-08-25
Job specializations:
  • Engineering
    Quality Engineering, Manufacturing Engineer, Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 165000 - 210000 USD Yearly USD 165000.00 210000.00 YEAR
Job Description & How to Apply Below

Project Architect – ASIC Manufacturing, Package, Test & Qualification

Engineering & Technology – San Jose, California, USA
Confidential

Join IC-Link by imec and help customers bring complex ASIC and SoC products from concept toward manufacturing. As part of the Project Architect team, you will combine deep technical expertise in semiconductor packaging, production test, qualification, and supply chain management with strong customer engagement and project leadership skills.

About the role

IC-Link by imec is looking for an experienced Project Architect to support business development activities and help define manufacturing solutions for customer ASIC and SoC programs.

In this role, you will oversee multiple customer projects and develop technical and commercial solutions covering packaging, production testing, qualification, and related manufacturing activities
. You will work closely with customers, business development managers, design teams, external manufacturing partners, and other internal stakeholders to translate customer requirements into executable project proposals.

A strong technical background in post-silicon semiconductor manufacturing is essential for success in this role.

What you will do
  • Serve as the technical lead during the pre-sales phase for customer ASIC and SoC manufacturing opportunities.
  • Define project scope, timelines, costs, technical deliverables, and risks in partnership with the Business Development Manager, helping position IC-Link to win customer programs while maximizing value creation.
  • Develop manufacturing solutions spanning semiconductor packaging, production testing, qualification, and supply chain management
    .
  • Demonstrate IC-Link by imec's expertise and capabilities in package development, test, qualification, and manufacturing services.
  • Respond to customer technical questions and translate customer requirements into clear and executable manufacturing solutions.
  • Collaborate closely with customers as well as internal technical, commercial, and operational teams across multiple functions.
  • Represent your portfolio of projects to key stakeholders and work closely with design managers and directors to ensure alignment with broader organizational and customer objectives.
  • Develop detailed statements of work, ensuring appropriate diligence around technical deliverables, assumptions, timelines, risks, and commercial considerations.
  • Work with global OSAT and manufacturing partners to identify appropriate solutions for customer programs.
  • Stay informed about semiconductor industry trends, advanced packaging technologies, and IC-Link by imec's competitive positioning within ASIC manufacturing services.
  • Identify opportunities to improve the quality, efficiency, and speed of our customer engagement and project-definition processes.
  • Contribute new ideas and support their implementation across the organization.
Who you are
  • You hold a BSc or MSc in Microelectronics, Electrical Engineering, Physics, Applied Physics
    , or a related technical discipline.
  • You have 10+ years of professional experience in post-silicon ASIC manufacturing
    , with significant expertise across packaging, production test, and qualification.
  • You have strong technical knowledge of:
  • Package design, including substrate design and assembly.
  • Wafer sort and final production test.
  • Semiconductor qualification requirements and JEDEC standards, including applications for automotive and space environments.
  • You have extensive experience with mainstream semiconductor packages such as FCBGA, WLCSP, QFN, and QFP
    , as well as advanced packaging technologies such as 2.5D/CoWoS and 3D integration technologies including WoW and CoW
    .
  • You have solid knowledge of production test strategies, manufacturing test flows, and semiconductor qualification processes.
  • You have experience working with OSATs and manufacturing partners in a global environment
    .
  • You understand the commercial aspects of semiconductor design development, NPI, and production pricing models and are comfortable performing financial calculations and evaluating project economics.
  • You have experience developing statements of work (SOWs) with careful attention to both technical deliverables and…
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