Ethernet Scale-Up RTL Lead​/Principal Engineer

Ethernet Scale-Up RTL Lead/Principal Engineer

Role Overview

TYLsemi is developing purpose-built connectivity chiplet for HPC/rack-scale AI systems. We are seeking a Principal Engineer Ethernet Scale-up to lead the architecture and design of next-generation Ethernet Scale-Up Networking (ESUN) solution. This is a high-impact technical role.

What You'll Do

• Define architecture for Ethernet-based AI scale-up interconnects and accelerator fabrics.
• Lead development of high-performance Ethernet Subsystem microarchitectures including RDMA, packet processing, network offload, traffic management, congestion control, and reliability mechanisms.
• Drive execution from architecture through RTL, verification, physical design, silicon bring-up, and production.
• Optimize performance, latency, scalability, power, and reliability for demanding AI and HPC workloads.
• Collaborate across hardware, firmware, software, and system teams to deliver industry-leading AI networking solutions.
• Serve as a company-wide technical leader, influencing product strategy, roadmap, and architectural direction.

What We're Looking For

• 15+ years of ASIC/SoC architecture and design experience.
• Proven track record delivering networking, NIC, switch, DPU, accelerator interconnect, or high-speed connectivity silicon.
• Deep expertise in System Verilog/RTL design and high-performance datapath architecture.
• Strong knowledge of Ethernet, RDMA, traffic management, congestion control, and scalable fabric architectures.
• Experience across the full ASIC lifecycle, from architecture to production silicon.

Good to Have

• Ultra Ethernet, UALink, RoCEv2, Infini Band
• AI/HPC interconnects and collective communication acceleration
• 400G/800G/1.6T Ethernet systems
• High-speed Ser Des and advanced networking architectures

Success in This Role Looks Like

• Ethernet Scale-Up Networking architecture is defined and validated for next-gen HPC/rack-scale AI systems, with clear technical direction across accelerator fabrics.
• High-performance Ethernet subsystem microarchitecture (RDMA, packet processing, offload, traffic management, congestion control) is delivered on schedule and meets production-quality reliability bars.
• Programs move cleanly from architecture through RTL, verification, physical design, and silicon bring-up with minimal rework.
• Performance, latency, power, and reliability targets are met or exceeded for demanding AI/HPC workloads.
• Cross-functional teams (hardware, firmware, software, systems) are aligned and unblocked, with this role recognized as a trusted technical authority shaping product strategy and roadmap.

Compensation:
The compensation range shown belowrepresentstotal target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.

In addition to cash compensation, this position is eligible for equity in the form of stock options,givingyou the opportunity to sharein the Company’s long-term growth and success.

About TYLsemi, Inc.

The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem:
how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?

That's what we solve. TYLsemi builds the chiplet infrastructure IP — the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.

This isn't a nice-to-have. It's the critical path.

The semiconductor industry is going through its biggest architectural shift in 40 years:

• Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future…