Principal Package Design Engineer

We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.

• Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:
  • Flip-chip, Chip Embedding
  • Wafer-level packaging (WLP/FOWLP)
  • Panel-level packaging (laminate, molding)
  • 2.5D/3D packaging
  • System-in-package (SiP)
  • Ball grid array (BGA/CSP)
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
• Drive package technology selection and development for new product introductions.
• Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.
• Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations and analysis related to:
  • Signal integrity / power integrity
  • Thermal performance
  • Mechanical stress / warpage
  • Design for manufacturability (DFM)
• Develop assembly flows and process requirements for OSATs and manufacturing partners.
• Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
• Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.
• Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
• Create and maintain package specifications, design rules, process documentation, and technical reports.
• Mentor junior engineers and provide technical leadership across packaging initiatives.

• MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or advanced electronics packaging.
• Strong knowledge of advanced packaging technologies, materials, and assembly processes.
• Experience with package reliability testing and qualification standards.
• Deep understanding of thermal, mechanical, and electrical interactions in package design.
• Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
• Ability to troubleshoot packaging failures and drive root cause/corrective action.
• Strong project leadership and cross-functional communication skills.

• Master’s or PhD in a relevant engineering discipline.
• Experience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETS, Power Modules, Intelligent Power modules and their applications in consumer and industrial, automotive, performance computing.computing, AI/ML hardware or mobile products.
• Hands‑on experience with tools for package design and simulation such as:
  • Cadence Allegro Package Designer
  • Solid works
  • ANSYS
  • COMSOL
  • JMP / Minitab
• Knowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.
• Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.

At Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect.

The base salary range $195,000 - $240,000…