Principal Signal Integrity Engineer; SI/PI
Listed on 2026-10-05
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Engineering
Test Engineer, Hardware Engineer, Electronics Engineer, Systems Engineer
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Lead Signal and Power Integrity development as a Principal Engineer within AMD's Adaptive and Embedded Computing Group (AECG). This role will drive SI/PI strategy and execution across silicon, package, board, and system-level designs supporting next-generation FPGA and adaptive computing products. Working closely with Architecture, Package Design, PCB Design, Silicon Engineering, Product Engineering, and Manufacturing teams, this engineer will play a critical role in defining technical direction, making key design tradeoff decisions, mentoring junior engineers, and delivering successful products from simulation through hardware validation.
THE PERSONA strong technical leader with deep Signal Integrity expertise and a solid understanding of Power Integrity fundamentals. Successful candidates will combine advanced simulation expertise with hands‑on lab measurement and debug experience, enabling them to correlate analysis with real‑world results. We are looking for a self‑starter who can independently drive complex technical challenges, influence cross‑functional stakeholders, mentor engineers, and guide critical design decisions across the product lifecycle.
KEY RESPONSIBILITIES:- Responsible for technical solution development for Signal Integrity and Power Integrity.
- Drive system‑level SI/PI architecture, design guidelines, and layout recommendations.
- Perform end‑to‑end channel simulations for high‑speed serial interfaces and memory subsystems.
- Lead SI/PI analysis and optimization of DDR4, DDR5, LPDDR4, LPDDR5, HBM, and other high‑performance memory interfaces.
- Correlate simulations with lab measurements and drive root‑cause analysis of signal and power integrity issues.
- Collaborate with silicon, package, PCB, architecture, and manufacturing teams to resolve complex SI/PI challenges.
- Guide junior engineers on simulation methodologies, measurements, and debug techniques.
- Evaluate future package and PCB technologies to support next‑generation FPGA and adaptive computing products
- Excellent analytical and problem‑solving skills with strong attention to detail.
- Proven ability to independently drive technical decisions and influence engineering direction.
- Strong communication and cross‑functional collaboration skills.
- Hands‑on experience performing lab measurements and correlating hardware results to simulation models.
- Deep expertise in Signal Integrity with working knowledge of Power Integrity concepts and methodologies.
- Experience with DDR, LPDDR, HBM, or other high‑performance memory interfaces.
- Experience with FPGA, adaptive computing, ASIC, networking, datacenter, or high‑performance computing platforms.
- Experience with PCB, package, and IC‑level power delivery networks.
- Expertise with SI/PI analysis tools including ADS and HFSS; experience with SIwave and HSPICE is a plus.
- Strong foundation in electromagnetic theory, transmission lines, and circuit analysis.
- Experience mentoring engineers and driving technical leadership across organizations.
- Experience with programming in Python, C++, Matlab.
- MS or PhD in Electrical Engineering preferred
- San Jose, California
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