Temp BGA Rework Assembler

Job Description

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors.

Sanmina Corporation has facilities strategically located in key regions throughout the world.

Performs specialized, high-precision electronics rework and micro-soldering repairs on complex Printed Circuit Board Assemblies (PCBAs). Operates split-vision optical alignment rework stations and automated X-ray inspection equipment to remove, replace, and reflow Ball Grid Array (BGA) and fine-pitch SMT components. Determines proper thermal profiles, prepares circuit board sites, and executes trace repairs under high magnification in strict compliance with IPC-A-610 and IPC-7711/7721 standards.

• Precision Rework:
  
  Operate specialized hot-air or infrared BGA rework stations to safely de-solder, align, and reflow complex BGA, micro-BGA, QFN, and fine-pitch SMT components.
• Site Preparation & Reballing:
  
  Manually clean residual solder from PCB pads using specialized soldering irons, micro-wicks, and flux. Perform BGA component reballing utilizing alignment stencils and paste.
• Circuit Board Repair:
  
  Execute micro-soldering repairs on damaged, lifted, or torn circuit board pads, traces, and mask layers under a high-magnification microscope.
• Quality Inspection:
  
  Set up, run, and interpret Automated X-ray Inspection (AXI) imagery to identify subsurface defects including solder bridging, voids, opens, and misalignment.
• Process Calibration:
  
  Program, select, and modify thermal profiles (preheat, soak, reflow, cool) specific to board thickness, component mass, and lead-free (RoHS) or leaded alloy requirements.
• Compliance:
  
  Ensure all rework strictly conforms to IPC-A-610 and IPC-7711/7721 Class 2 and Class 3 manufacturing requirements.
• Data Logging:
  
  Accurately document all repair actions, failure modes, and component traceability details into the Manufacturing Execution System (MES) software.

• Experience:
  
  Minimum of 2–4 years of hands-on experience in electronics manufacturing focusing specifically on SMT repair and BGA rework. With at least 1 year of direct experience operating
  
  Air-Vac DRS series or similar high-end split-vision rework machinery.
• Technical
  
  Certifications:
  
  Current or prior certification inIPC-A-610andIPC-7711/7721is highly preferred.
• Equipment Knowledge:
  
  Proficiency with split-vision rework systems (e.g., Manncorp, SRT, VJE, Air-Vac) and X-ray inspection machinery.
• Dexterity:
  
  Exceptional hand-eye coordination, steady hand control, and the ability to work under a microscope for extended periods.
• Schematic Literacy:
  
  Ability to read and accurately interpret electronic schematics, fabrication blueprints, bills of materials (BOM), and assembly documentation.

• ESD Control:
  
  Must strictly follow all Electrostatic Discharge (ESD) protective protocols (wrist straps, heel grounders, static-safe smocks).
• Physical Ability:
  
  Able to sit or stand for long durations and lift up to 25 pounds occasionally.
• Safety:
  
  Safe handling of chemicals, fluxes, and solvents under proper fume extraction hoods.

Sanmina is an Equal Opportunity Employer

Salary Range(annual): $37,700- $55,000 ($18.12 - $26.44 hourly)