Senior Module Engineer

Role Overview:
Senior Module Engineer at Lucidean

As a Senior Module Engineer you will play a lead role in the development of our integrated hardware platform by spearheading our Coh Zero™ transceiver module development and commercialization activities. In this role, you will work closely with the photonic integrated circuit (PIC) development team, the systems team, and the test and characterization team to drive Lucidean’s core technology into final module products.

• Define hardware architectures for our next-generation optical transceiver modules
• Translate system requirements into optical/electrical/mechanical design specifications.
• Ensure integrated module is designed for reliability, manufacturing, and cost
• Work closely with PIC team to ensure optical engine compatibility with modules
• Optimize optical coupling (attach, lensing, tolerances) for performance and manufacturability.
• Oversee high-speed PCB design, signal integrity, and power integrity for PAM4/coherent lanes
• Guide DSP/driver/AFE integration and testing.
• Thermal modeling, heatsink design, and module reliability strategies for high-power plug gables.
• Work with test team to establish test plans for module characterization (optical eye, TDECQ, jitter, sensitivity, power consumption).
• Lead system-level validation in customer-like environments (switch/router/AI cluster testbeds)
• Own early prototypes: hands-on assembly, debugging, and troubleshooting at the bench.
• Engage with optics, IC, and packaging vendors to qualify components and negotiate specs.
• Define DFM/DFT strategies, including optical/electrical test, assembly tolerances, and burn-in.
• Ensure modules comply with MSAs, IEEE/ITU standards, and Telcordia reliability requirements.
• Support technical discussions with early customers and partners, providing module performance data and roadmap alignment.

• M.S. or Ph.D. in Electrical Engineering, Physics, Optics, or related field.
• 5 years of experience in optical module/hardware development
• High-Speed Electronics:
  Experience with PAM4 and/or coherent links, Ser Des, TIAs, drivers, DSPs.
• Signal Integrity & RF:
  Eye diagrams, jitter analysis, TDECQ, crosstalk, channel modeling.
• Packaging & Assembly:
  Fiber attach, lens alignment, hermetic/non-hermetic packaging, PCB layout, co-packaged optics.
• Thermal modeling, heatsink design, reliability testing under high power density.
• Standards Knowledge: IEEE 802.3, OIF, MSAs (QSFP, OSFP, COBO, LPO/CPO).
• Test & Characterization:
  Familiar with BERTs, high-speed oscilloscopes, optical spectrum analyzers, automated test platforms.
• Simulation/Modeling Tools:
  Lumerical, Zemax, HFSS, ADS, COMSOL, or equivalent.
• DFM/DFT, Telcordia GR-468, accelerated lifetime testing, yield optimization.
• Strong teamwork, collaboration, and communication skills.