Prototyping Engineer

Position

Protofab Packaging Engineer (Position Number: , Job Code: 004758) – Department:
Electrical & Computer Engineering, work location:
Protofab at OASIS.

Working days/hours:
Monday–Friday, 8 am–5 pm.

Salary: $85,400 – $156,800 per year. Full benefits eligibility.

The Protofab Packaging Engineer supports operation, development, and growth of the OASIS advanced packaging and prototyping facility (Protofab). The role provides technical expertise in microelectronics, photonics, and optoelectronic device packaging, enabling researchers and external users to translate device concepts into functional packaged prototypes.

• 50% Process Development – develop, optimize, validate, and release process recipes, machine parameters, and workflows for advanced packaging and prototyping tools. Update processes for new materials and device architectures and collaborate on experiments, characterization plans, and process integration.
• 30% User Support and Training – train and certify users on equipment operation and safe laboratory practices; provide technical consultation on packaging strategies, materials selection, assembly flows, reliability considerations and prototype feasibility; perform hands‑on assembly and packaging work.
• 10% Operations and Maintenance – monitor tool readiness, consumables inventory, and facility functionality; coordinate preventive maintenance, vendor service visits, calibrations and repairs; troubleshoot process excursions and equipment faults.
• 10% Documentation and Compliance – maintain SOPs, process documentation, maintenance logs, training records and internal operating procedures. Support safety programs, regulatory compliance and quality practices.

• Bachelor's Degree in related area and/or equivalent experience/training.
• 1–3 years semiconductor packaging, microfabrication, device prototyping, or closely related engineering environment.
• Knowledge of engineering principles and methods for prototype development and process optimization.
• Ability to independently troubleshoot tools, processes, and assembly challenges.
• Experience developing SOPs, recipes, training materials, and technical documentation.
• Strong written and verbal communication skills with technical and non‑technical users.
• Ability to train users and communicate safe operating practices.
• Strong organizational skills with ability to prioritize multiple projects.
• Collaborative mindset with faculty, students, startups, vendors, and industry partners.
• Familiarity with laboratory safety, hazardous materials handling, ESD controls, and quality systems.

• Master's Degree in semiconductor fabrication, packaging, photonics, or related engineering discipline.
• 4–6 years hands‑on experience operating die bonders, wire bonders, fiber alignment systems, optical assembly tools, reliability systems, or similar equipment.
• 4–6 years industry experience in photonics, optoelectronics, or advanced package development in research or production environments.
• Experience with photonics or optoelectronic packaging design.

• Satisfactory criminal history background check.
• UCSB is a tobacco‑free environment.

The University of California is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, age, protected veteran status, or other protected status under state or federal law.